Joined structural body of members, joining method of members, and package for containing an electronic component

Abstract

According to one embodiment, a joined structural body for mounting an electronic component on the body which is provided with a first member, a second member and a joining portion. The joining portion is provided between the first member and the second member so as to connect the first member and the second member with each other mechanically. The joining portion contains at least one metal of a tin, an indium or a zinc, and a copper. The content of the metal in the joining portion decreases toward a side of at least one of the first member and the second member, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the metal.

What is claimed is: 
     
         1 . A joined structural body for mounting an electronic component on the body, comprising:
 a first member;   a second member; and   a joining portion provided between the first member and the second member so as to connect the first member and the second member with each other mechanically, the joining portion containing at least one metal of a tin, an indium or a zinc, and a copper, the content of the metal in the joining portion decreasing toward a side of at least one of the first member and the second member, the content of the copper in the joining portion increasing in the same direction as the decreasing direction of the content of the metal.   
     
     
         2 . The joined structural body according to  claim 1 , wherein the content of the metal decreases toward both sides of the first member and the second member, and the content of the copper increases toward both sides of the first member and the second member. 
     
     
         3 . The joined structural body according to  claim 2 , wherein the joining portion includes a first layer containing copper which is provided on a side of the first member, and a second layer containing copper which is provided on a side of the second member. 
     
     
         4 . The joined structural body according to  claim 1 , wherein the joining portion contains at least one of a gold or a platinum. 
     
     
         5 . The joined structural body according to  claim 2 , wherein the joining portion contains at least one of a gold or a platinum. 
     
     
         6 . The joined structural body according to  claim 3 , wherein the joining portion contains at least one of a gold or a platinum. 
     
     
         7 . The joined structural body according to  claim 1 , wherein the first member is made of one of a copper or a copper alloy, and the second member is made of an alloy containing an iron. 
     
     
         8 . The joined structural body according to  claim 1 , wherein at least one of the first member and the second member contains a ceramic material. 
     
     
         9 . A method of joining members which forms a joined structural body for mounting an electronic component on the body, comprising:
 bringing a surface of a first member containing a copper into contact with a surface of a first joining metal layer of at least one metal of a tin (Sn), an indium (In) or a zinc (Zn) which is formed on a second member, and   heating the first member and the second member so as to diffuse the at least one metal from the surface of the first member containing the copper into an inside of the first member while maintaining the contact between the first member and the first joining metal layer.   
     
     
         10 . The method of joining members according to  claim 9 , wherein a second joining metal layer containing a copper is formed on the surface of the first member, and a surface of the second joining metal layer and the surface of the first joining metal layer are brought into contact with each other. 
     
     
         11 . The method of joining members according to  claim 9 , wherein a third joining metal layer containing a copper is formed between the first member and the first joining metal layer. 
     
     
         12 . The method of joining members according to  claim 10 , wherein a third joining metal layer containing a copper is formed between the first member and the first joining metal layer. 
     
     
         13 . The method of joining members according to  claim 9 , wherein protective metal layers are provided on the surface of the first member and the surface of the first joining metal layer respectively. 
     
     
         14 . The method of joining members according to  claim 13 , wherein the protective metal layers contains at least one of a gold or a platinum. 
     
     
         15 . A package comprising:
 a substrate on which an electronic component is mounted; and   a frame body which surrounds a portion on which the electronic component is mounted, the frame body being joined mechanically with the substrate via a joining portion containing at least one metal of a tin, an indium or a zinc, and a copper,   wherein the content of the at least one metal in the joining portion decreases toward a side of at least one of the substrate or the fame body, and the content of the copper in the joining portion increases in the same direction as the decreasing direction of the content of the at least one metal.   
     
     
         16 . The package according to  claim 15 , further comprising a feed through terminals for inputting a signal into the electronic component and for outputting a signal from the electronic component respectively, wherein
 the joining portion includes a first joining portion and a second joining portion, and   the substrate and the feed through terminals are joined via the first joining portion, and the frame body and the feed through terminals are joined via the second joining portion.   
     
     
         17 . The package according to  claim 15 , wherein
 the content of the metal decreases toward both sides of the substrate and the frame body, and   the content of the copper increases toward both sides of the substrate and the frame body.   
     
     
         18 . The package according to  claim 15 , wherein the joining portion has a first layer containing a copper which is provided on a side of the substrate, and a second layer containing a copper which is provided on a side of the frame body. 
     
     
         19 . The package according to  claim 15 , wherein the joining portion contains at least one of a gold or a platinum.