Assignee
TAKAMOTO NAOHIDE
JP·15 granted patents·4 pending applications·42 citations·filing 2010–2012
Top patents by PatentIndex Score
19 records- 0192US8722517B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted May 13, 2014·7 cites·1 claims
- 0287US8986486B2Film for semiconductor device production, method for producing film for semiconductor device production, and method for semiconductor device productionTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 24, 2015·8 cites·3 claims
- 0382US8513816B2Film for flip chip type semiconductor back surface containing thermoconductive fillerTAKAMOTO NAOHIDE·Filed 2011·Granted Aug 20, 2013·5 cites·8 claims
- 0481US8237294B2Dicing tape-integrated wafer back surface protective filmTAKAMOTO NAOHIDE·Filed 2010·Granted Aug 7, 2012·4 cites·5 claims
- 0575US8643194B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 4, 2014·4 cites·10 claims
- 0674US8692389B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 8, 2014·3 cites·5 claims
- 0773US8492907B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 23, 2013·3 cites·8 claims
- 0869US8652938B2Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Feb 18, 2014·2 cites·9 claims
- 0968US9074113B2Film for flip chip type semiconductor back surface, dicing tape-integrated film for semiconductor back surface, process for producing semiconductor device, and flip chip type semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Jul 7, 2015·2 cites·5 claims
- 1068US8420509B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 16, 2013·2 cites·6 claims
- 1167US8558397B2Dicing tape-integrated wafer back surface protective filmTAKAMOTO NAOHIDE·Filed 2012·Granted Oct 15, 2013·1 cites·5 claims
- 1261US8704382B2Film for flip chip type semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted Apr 22, 2014·1 cites·6 claims
- 1348US2012028380A1Dicing tape-integrated film for semiconductor back surface and method for producing the film, and method for producing semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 1447US2012028416A1Film for flip chip type semiconductor back surface and its useTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 1546US9035466B2Dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2010·Granted May 19, 2015·0 cites·3 claims
- 1644US9911683B2Film for back surface of flip-chip semiconductorTAKAMOTO NAOHIDE·Filed 2011·Granted Mar 6, 2018·0 cites·7 claims
- 1740US9196533B2Film for back surface of flip-chip semiconductor, dicing-tape-integrated film for back surface of semiconductor, process for producing semiconductor device, and flip-chip semiconductor deviceTAKAMOTO NAOHIDE·Filed 2011·Granted Nov 24, 2015·0 cites·8 claims
- 1839US2012021174A1Film for flip chip type semiconductor back surface, and dicing tape-integrated film for semiconductor back surfaceTAKAMOTO NAOHIDE·Filed 2011·Application pending·0 cites
- 1937US2010261314A1Thermosetting die bonding filmTAKAMOTO NAOHIDE·Filed 2010·Application pending·0 cites
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