Assignee
TONG HSING ELECTRONIC INDUSTRIES LTD
TW·29 granted patents·83 pending applications·17 citations·filing 1990–2025
Top patents by PatentIndex Score
112 records- 0193US11764240B2Method of manufacturing image sensing chip package structure including an adhesive loopTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Sep 19, 2023·2 cites·4 claims
- 0292US11967652B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Apr 23, 2024·1 cites·14 claims
- 0388US11411029B2Image sensing chip package structure including adhesive loopTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2020·Granted Aug 9, 2022·2 cites·8 claims
- 0487US2026033027A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0586US2026068340A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0686US2026068339A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 0779US12224359B2Sensor package structure having solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 11, 2025·0 cites·11 claims
- 0879US11984516B2Sensor package structure having ring-shaped solder mask frameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted May 14, 2024·0 cites·14 claims
- 0970US7811861B2Image sensing device and packaging method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2008·Granted Oct 12, 2010·2 cites·8 claims
- 1070US2023395624A1Sensor package structure and chip-scale sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1170US2026077348A1Package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1267US2025249523A1Method for producing active metal ceramic substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1365US2025010408A1Active metal brazing substrate material containing aluminum metal element and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1464US2025162951A1Metal-ceramic substrate having double brazing layers and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1562US2025253608A1Multi-layer composite heat dissipation substrateTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1662US2025001730A1Pre-mold direct bond copper (dbc) substrate and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 1762US2026052793A1Chip packaging structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1862US2026006924A1Method for manufacturing image sensing device and image sensing deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 1961US12177996B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 24, 2024·0 cites·10 claims
- 2061US2025380519A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2160US12575204B2Sensor package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Granted Mar 10, 2026·0 cites·20 claims
- 2260US12490541B2Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Dec 2, 2025·0 cites·12 claims
- 2360US2026053032A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2460US2025355213A1Sensor lens assembly and housing thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2560US2026047219A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2659US12563850B2Optical package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Granted Feb 24, 2026·0 cites·15 claims
- 2759US2026005182A1Power semiconductor package and fabrication method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2025·Application pending·0 cites
- 2859US2025391779A1Surface mount power device and fabrication method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 2959US2025316558A1Transistor outline packaging structure and packaging method of transistor outline packaging structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3058US2025309087A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3158US2025120203A1Image sensing moduleTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3258US2025354862A1Sensor package structure and sensing module thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3358US2024234166A9Chip package structure and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 3458US2025385148A1Power semiconductor deviceTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3558US2026047480A1Power chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3658US2025293201A1Power chip package structure and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3758US2026059659A1Electronic assembly, soldering board, and oxygen-free copper layerTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3858US2025142730A1Power component submount and manufacturing method thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 3958US2025248150A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4058US2026068059A1Composite ceramic substrate and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4158US2025079267A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4257US12356742B2Chip packaging structure and chip packaging methodTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2022·Granted Jul 8, 2025·0 cites·10 claims
- 4357US2024234457A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4457US2025185413A1Optical package structure and optical chip thereofTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4557US2025336878A1Power chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4657US2025253203A1Metal ceramic substrate and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4757US2024371820A1Chip package structure and method for producing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 4857US2024047491A1Sensor package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2023·Application pending·0 cites
- 4957US2026005110A1Chip package structureTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
- 5057US2025294675A1Double-side active metal brazing substrate and method for manufacturing the sameTONG HSING ELECTRONIC INDUSTRIES LTD·Filed 2024·Application pending·0 cites
Showing the top 50 of 112 patent records by PatentIndex Score.
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