Assignee
TONGFU MICROELECTRONICS CO LTD
CN·28 granted patents·9 pending applications·28 citations·filing 2013–2025
Top patents by PatentIndex Score
37 records- 0188US9620468B2Semiconductor packaging structure and method for forming the sameTONGFU MICROELECTRONICS CO LTD·Filed 2013·Granted Apr 11, 2017·12 cites·19 claims
- 0286US10067162B2Testing probe, semiconductor testing fixture and fabrication method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Sep 4, 2018·3 cites·8 claims
- 0380US10006939B2Testing probe and semiconductor testing fixture, and fabrication methods thereofTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·2 cites·18 claims
- 0480US9922950B2Method and structure for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2017·Granted Mar 20, 2018·3 cites·14 claims
- 0580US2025293132A1Chip packaging method and chip packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0680US2025293049A1Fan-out chip packaging methodTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0780US2025293209A1Chip packaging method and chip packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2025·Application pending·0 cites
- 0877US9761549B2Semiconductor device and fabrication methodTONGFU MICROELECTRONICS CO LTD·Filed 2013·Granted Sep 12, 2017·6 cites·3 claims
- 0976US10937745B2Semiconductor chip package arrayTONGFU MICROELECTRONICS CO LTD·Filed 2019·Granted Mar 2, 2021·2 cites·7 claims
- 1069US11791310B2Semiconductor packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Oct 17, 2023·0 cites·11 claims
- 1166US11670571B2Semiconductor chip package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Jun 6, 2023·0 cites·13 claims
- 1263US2021233890A1Packaging structuresTONGFU MICROELECTRONICS CO LTD·Filed 2021·Application pending·0 cites
- 1359US11948960B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·20 claims
- 1459US11139267B2Packaging structure and forming method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2019·Granted Oct 5, 2021·0 cites·14 claims
- 1558US11127661B2Semiconductor chip package method and semiconductor chip package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2019·Granted Sep 21, 2021·0 cites·9 claims
- 1658US10998289B2Packaging structure and forming method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2019·Granted May 4, 2021·0 cites·16 claims
- 1758US2024321825A1Fan-out packaging method and packaging structure thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1858US2024321854A1Fan-out packaging method and packaging structure of stacked chips thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 1958US2024321853A1Packaging method and packaging structure of multi-layer stacked high-bandwidth memoryTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2058US2024321704A1Fan-out packaging method and packaging structure of stacked chips thereofTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2158US2024321821A1Packaging method and packaging structure of multi-layer stacked memoryTONGFU MICROELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 2254US11948911B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Apr 2, 2024·0 cites·17 claims
- 2353US12074183B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted Aug 27, 2024·0 cites·20 claims
- 2453US11990432B2Semiconductor packaging method and semiconductor package deviceTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·10 claims
- 2553US10910343B2Package structure with improvement layer and fabrication method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2019·Granted Feb 2, 2021·0 cites·19 claims
- 2651US11990398B2Semiconductor package device having chip substrate with pads around photosensitive regionTONGFU MICROELECTRONICS CO LTD·Filed 2021·Granted May 21, 2024·0 cites·17 claims
- 2751US10001509B2Semiconductor testing fixture and fabrication method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Jun 19, 2018·0 cites·18 claims
- 2850US10119993B2Testing probe and semiconductor testing fixture, and fabrication methods thereofTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Nov 6, 2018·0 cites·9 claims
- 2949US10006943B2Semiconductor testing fixture and fabrication method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·14 claims
- 3049US9666550B2Method and structure for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted May 30, 2017·0 cites·11 claims
- 3148US10515883B23D system-level packaging methods and structuresTONGFU MICROELECTRONICS CO LTD·Filed 2017·Granted Dec 24, 2019·0 cites·9 claims
- 3247US10770425B2Flip-chip methodTONGFU MICROELECTRONICS CO LTD·Filed 2018·Granted Sep 8, 2020·0 cites·20 claims
- 3343US9837371B2Structure and method of reinforcing a conductor soldering point of semiconductor deviceTONGFU MICROELECTRONICS CO LTD·Filed 2014·Granted Dec 5, 2017·0 cites·18 claims
- 3442US11430706B2Packaging structureTONGFU MICROELECTRONICS CO LTD·Filed 2018·Granted Aug 30, 2022·0 cites·15 claims
- 3538US12119308B2Packaging structure of semiconductor chip and formation method thereofTONGFU MICROELECTRONICS CO LTD·Filed 2020·Granted Oct 15, 2024·0 cites·20 claims
- 3636US10741499B2System-level packaging structuresTONGFU MICROELECTRONICS CO LTD·Filed 2016·Granted Aug 11, 2020·0 cites·12 claims
- 3731US10008478B2Fabricating method for wafer-level packagingTONGFU MICROELECTRONICS CO LTD·Filed 2015·Granted Jun 26, 2018·0 cites·20 claims
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