Assignee
TSENG TZYY-JANG
TW·18 granted patents·9 pending applications·38 citations·filing 2005–2014
Top patents by PatentIndex Score
27 records- 0187US8859912B2Coreless package substrate and fabrication method thereofTSENG TZYY-JANG·Filed 2011·Granted Oct 14, 2014·9 cites·16 claims
- 0284US8513796B2Package structure, fabricating method thereof, and package-on-package device therebyTSENG TZYY-JANG·Filed 2012·Granted Aug 20, 2013·6 cites·12 claims
- 0382US8624382B2Packaging substrate and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·5 cites·4 claims
- 0478US8390013B2Semiconductor package structure and fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2010·Granted Mar 5, 2013·5 cites·5 claims
- 0574US8624366B2Semiconductor package structure and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Jan 7, 2014·3 cites·5 claims
- 0673US9510464B2Manufacturing method of circuit boardTSENG TZYY-JANG·Filed 2012·Granted Nov 29, 2016·2 cites·12 claims
- 0773US8424202B2Process for fabricating a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Apr 23, 2013·2 cites·13 claims
- 0871US8294034B2Circuit board and process for fabricating the sameTSENG TZYY-JANG·Filed 2010·Granted Oct 23, 2012·3 cites·20 claims
- 0970US8288662B2Circuit structureTSENG TZYY-JANG·Filed 2010·Granted Oct 16, 2012·2 cites·12 claims
- 1061US8598463B2Circuit board and manufacturing method thereofTSENG TZYY-JANG·Filed 2011·Granted Dec 3, 2013·0 cites·11 claims
- 1161US8450623B2Circuit boardTSENG TZYY-JANG·Filed 2010·Granted May 28, 2013·1 cites·8 claims
- 1256US8835992B2Electronic device comprising electrical contact padsTSENG TZYY-JANG·Filed 2011·Granted Sep 16, 2014·0 cites·6 claims
- 1353US8578600B2Process for manufacturing a circuit boardTSENG TZYY-JANG·Filed 2010·Granted Nov 12, 2013·0 cites·11 claims
- 1450US8912642B2Packaging substrate and fabrication method thereofTSENG TZYY-JANG·Filed 2012·Granted Dec 16, 2014·0 cites·4 claims
- 1549US9257379B2Coreless packaging substrate and method of fabricating the sameTSENG TZYY-JANG·Filed 2012·Granted Feb 9, 2016·0 cites·5 claims
- 1649US2012312588A1Circuit boardTSENG TZYY-JANG·Filed 2012·Application pending·0 cites
- 1747US8563363B2Fabricating method of semiconductor package structureTSENG TZYY-JANG·Filed 2012·Granted Oct 22, 2013·0 cites·14 claims
- 1847US2016050761A1Substrate structure and method of manuifacturing the sameTSENG TZYY-JANG·Filed 2014·Application pending·0 cites
- 1947US2014138559A1Lampshade and illumination moduleTSENG TZYY-JANG·Filed 2012·Application pending·0 cites
- 2045US2007087457A1Method for inspecting and mending defect of photo-resist and manufacturing process of printed circuit boardTSENG TZYY-JANG·Filed 2005·Application pending·0 cites
- 2145US2014071656A1Light source module and bulb lampTSENG TZYY-JANG·Filed 2013·Application pending·0 cites
- 2242US2010266752A1Method for forming circuit board structure of composite materialTSENG TZYY-JANG·Filed 2010·Application pending·0 cites
- 2342US2012031651A1Circuit boardTSENG TZYY-JANG·Filed 2010·Application pending·0 cites
- 2441US8247705B2Circuit substrate and manufacturing method thereofTSENG TZYY-JANG·Filed 2010·Granted Aug 21, 2012·0 cites·19 claims
- 2539US8161638B2Manufacturing method of circuit structureTSENG TZYY-JANG·Filed 2010·Granted Apr 24, 2012·0 cites·20 claims
- 2639US2012217627A1Package structure and method of fabricating the sameTSENG TZYY-JANG·Filed 2011·Application pending·0 cites
- 2733US2014071671A1T-bar lampTSENG TZYY-JANG·Filed 2013·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →