Assignee
UNISEM M BERHAD
MY·6 granted patents·6 pending applications·36 citations·filing 2004–2019
Top patents by PatentIndex Score
12 records- 0187US9337354B2Top port MEMS cavity package and method of manufacture thereofUNISEM M BERHAD·Filed 2015·Granted May 10, 2016·10 cites·10 claims
- 0276US9966326B2Lead frames with wettable flanksUNISEM M BERHAD·Filed 2015·Granted May 8, 2018·9 cites·17 claims
- 0376US9082883B2Top port MEMS cavity package and method of manufacture thereofUNISEM M BERHAD·Filed 2013·Granted Jul 14, 2015·5 cites·4 claims
- 0470US9783412B2Method for improving manufacturability of cavity packages for direct top port MEMS microphoneUNISEM (M) BERHAD·Filed 2015·Granted Oct 10, 2017·2 cites·10 claims
- 0561US8999757B2Top port MEMS cavity package and method of manufacture thereofUNISEM M BERHAD·Filed 2013·Granted Apr 7, 2015·2 cites·14 claims
- 0646US7544541B2Semiconductor packageUNISEM M BERHAD·Filed 2004·Granted Jun 9, 2009·8 cites·12 claims
- 0740US2018130769A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0839US2018130768A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 0935US2008237857A1Semiconductor packageUNISEM M BERHAD·Filed 2007·Application pending·0 cites
- 1034US2019259731A1Substrate based fan-out wafer level packagingUNISEM M BERHAD·Filed 2019·Application pending·0 cites
- 1129US2019181095A1Emi shielding for discrete integrated circuit packagesUNISEM M BERHAD·Filed 2017·Application pending·0 cites
- 1228US2018130720A1Substrate Based Fan-Out Wafer Level PackagingUNISEM M BERHAD·Filed 2016·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →