Assignee
UTAC HEADQUARTERS PTE LTD
SG·60 granted patents·29 pending applications·108 citations·filing 2015–2025
Top patents by PatentIndex Score
89 records- 0197US9704726B2Packaging structural memberUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Jul 11, 2017·35 cites·19 claims
- 0291US9805955B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Oct 31, 2017·5 cites·15 claims
- 0390US9978658B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted May 22, 2018·8 cites·18 claims
- 0490US9741642B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Aug 22, 2017·8 cites·21 claims
- 0589US10242934B1Semiconductor package with full plating on contact side surfaces and methods thereofUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Mar 26, 2019·6 cites·20 claims
- 0688US12100719B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Sep 24, 2024·1 cites·20 claims
- 0786US9922843B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 20, 2018·3 cites·16 claims
- 0885US10242953B1Semiconductor package with plated metal shielding and a method thereofUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 26, 2019·7 cites·20 claims
- 0985US9508623B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Nov 29, 2016·5 cites·31 claims
- 1083US11177301B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Nov 16, 2021·5 cites·20 claims
- 1182US10515878B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Dec 24, 2019·3 cites·16 claims
- 1282US9773722B1Semiconductor package with partial plating on contact side surfacesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Sep 26, 2017·4 cites·20 claims
- 1380US9786625B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Oct 10, 2017·3 cites·20 claims
- 1480US2024421169A1Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 1579US9589875B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Mar 7, 2017·2 cites·20 claims
- 1676US11227818B2Stacked dies electrically connected to a package substrate by lead terminalsUTAC HEADQUARTERS PTE LTD·Filed 2020·Granted Jan 18, 2022·1 cites·19 claims
- 1776US10163658B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Dec 25, 2018·1 cites·13 claims
- 1876US9570314B2Methods for singulating semiconductor waferUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 14, 2017·3 cites·20 claims
- 1975US2025126909A1Reliable semiconductors packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 2073US10381280B2Semiconductor packages and methods for forming semiconductor packageUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 13, 2019·2 cites·23 claims
- 2173US2026040961A1Semiconductor Device and Method of Disposing Electrical Components Above and Below SubstrateUTAC HEADQUARTERS PTE LTD·Filed 2025·Application pending·0 cites
- 2270US11145575B2Conductive bonding layer with spacers between a package substrate and chipUTAC HEADQUARTERS PTE LTD·Filed 2019·Granted Oct 12, 2021·2 cites·14 claims
- 2368US11881494B2Semiconductor package with damsUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jan 23, 2024·0 cites·20 claims
- 2468US10566369B2Image sensor with processor packageUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Feb 18, 2020·2 cites·20 claims
- 2567US9564387B2Semiconductor package having routing traces thereinUTAC HEADQUARTERS PTE LTD·Filed 2015·Granted Feb 7, 2017·1 cites·19 claims
- 2666US2025120204A1Multi-chip image sensor semiconductor packageUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 2765US12166050B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Dec 10, 2024·0 cites·20 claims
- 2865US10573590B2Multi-layer leadless semiconductor package and method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Feb 25, 2020·1 cites·11 claims
- 2964US2025151447A1Semiconductor Device and Method of Making a Semiconductor Package with a Glass CoverUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 3064US2025151421A1Semiconductor Device and Method of Making a Semiconductor Package with a Pre-Installed Glass CoverUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 3163US12211863B2Reliable semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jan 28, 2025·0 cites·20 claims
- 3263US2024339484A1Semiconductor Device and Method of Making an Optical Semiconductor PackageUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 3362US2025079261A1Semiconductor packages with thermal dissipationUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 3461US10734247B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Aug 4, 2020·0 cites·17 claims
- 3561US10325782B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jun 18, 2019·0 cites·16 claims
- 3661US2024186346A1Semiconductor packaging for image sensorsUTAC HEADQUARTERS PTE LTD·Filed 2023·Application pending·0 cites
- 3761US2026006726A1Semiconductor package with a cavity substrateUTAC HEADQUARTERS PTE LTD·Filed 2025·Application pending·0 cites
- 3860US10096490B2Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Oct 9, 2018·0 cites·14 claims
- 3960US10032645B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Jul 24, 2018·0 cites·16 claims
- 4060US9917038B1Semiconductor package with multiple molding routing layers and a method of manufacturing the sameUTAC HEADQUARTERS PTE LTD·Filed 2016·Granted Mar 13, 2018·0 cites·15 claims
- 4159US2025089388A1Reliable optical semiconductor packagesUTAC HEADQUARTERS PTE LTD·Filed 2024·Application pending·0 cites
- 4258US2019348387A1Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2019·Application pending·0 cites
- 4357US12302657B2Semiconductor device and method of forming an optical semiconductor package with a shield structureUTAC HEADQUARTERS PTE LTD·Filed 2022·Granted May 13, 2025·0 cites·20 claims
- 4456US12489078B2Semiconductor device and method of disposing electrical components above and below substrateUTAC HEADQUARTERS PTE LTD·Filed 2022·Granted Dec 2, 2025·0 cites·20 claims
- 4556US11710681B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2021·Granted Jul 25, 2023·0 cites·20 claims
- 4656US9881863B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Jan 30, 2018·0 cites·20 claims
- 4756US2023036239A1Semiconductor Device and Method of Making an Optical Semiconductor PackageUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 4856US2023098224A1Semiconductor packages with reliable coversUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 4956US2023122384A1Semiconductor packages with reliable coversUTAC HEADQUARTERS PTE LTD·Filed 2022·Application pending·0 cites
- 5055US10403592B2Semiconductor packages and methods of packaging semiconductor devicesUTAC HEADQUARTERS PTE LTD·Filed 2017·Granted Sep 3, 2019·0 cites·20 claims
Showing the top 50 of 89 patent records by PatentIndex Score.
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