Assignee
WAKISAKA SHINJI
JP·4 granted patents·1 pending application·10 citations·filing 2010–2011
Top patents by PatentIndex Score
5 records- 0186USRE43380ESemiconductor device including semiconductor element surrounded by an insulating member and wiring structures on upper and lower surfaces of the semiconductor element and insulating member, and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted May 15, 2012·7 cites·47 claims
- 0271US8319346B2Semiconductor structure and manufacturing method of semiconductor structureWAKISAKA SHINJI·Filed 2011·Granted Nov 27, 2012·3 cites·8 claims
- 0350US8525335B2Semiconductor construct and manufacturing method thereof as well as semiconductor device and manufacturing method thereofWAKISAKA SHINJI·Filed 2010·Granted Sep 3, 2013·0 cites·13 claims
- 0443US8487443B2Semiconductor structure, manufacturing method of semiconductor structure and semiconductor deviceWAKISAKA SHINJI·Filed 2011·Granted Jul 16, 2013·0 cites·14 claims
- 0538US2011304043A1Semiconductor device and manufacturing method of the sameWAKISAKA SHINJI·Filed 2011·Application pending·0 cites
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