Assignee

WENG CHAOFU

TW·1 granted patent·1 pending application·38 citations·filing 2009–2012

Technology mixH05K2 H10W2

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2 records

0187US8110916B2Chip package structure and manufacturing methods thereofWENG CHAOFU·Filed 2009·Granted Feb 7, 2012·38 cites·20 claims
0246US2012104634A1Chip package structure and manufacturing methods thereofWENG CHAOFU·Filed 2012·Application pending·0 cites

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