Individual holder
WOOD ALAN G
US·9 granted patents·1 pending application·104 citations·filing 2006–2012
Individually held — no corporate assignee on record.
Top patents by PatentIndex Score
10 records- 0199US8193646B2Semiconductor component having through wire interconnect (TWI) with compressed wireWOOD ALAN G·Filed 2010·Granted Jun 5, 2012·73 cites·4 claims
- 0290US8853072B2Methods of forming through-substrate interconnectsWOOD ALAN G·Filed 2011·Granted Oct 7, 2014·9 cites·26 claims
- 0385US8062958B2Microelectronic device wafers and methods of manufacturingWOOD ALAN G·Filed 2009·Granted Nov 22, 2011·8 cites·26 claims
- 0481US8513797B2Stacked semiconductor component having through wire interconnect (TWI) with compressed wireWOOD ALAN G·Filed 2012·Granted Aug 20, 2013·3 cites·10 claims
- 0579US8546931B2Stacked semiconductor components having conductive interconnectsWOOD ALAN G·Filed 2011·Granted Oct 1, 2013·3 cites·18 claims
- 0675US8187983B2Methods for fabricating semiconductor components using thinning and back side laser processingWOOD ALAN G·Filed 2009·Granted May 29, 2012·3 cites·19 claims
- 0772US8258006B2Method for fabricating stacked semiconductor componentsWOOD ALAN G·Filed 2008·Granted Sep 4, 2012·4 cites·12 claims
- 0868US8530895B2Thinned semiconductor components having lasered features and method of fabricationWOOD ALAN G·Filed 2012·Granted Sep 10, 2013·1 cites·16 claims
- 0958US2007103180A1Universal wafer carrier for wafer level die burn-inWOOD ALAN G·Filed 2006·Application pending·0 cites
- 1051US8455983B2Microelectronic device wafers and methods of manufacturingWOOD ALAN G·Filed 2011·Granted Jun 4, 2013·0 cites·20 claims
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →