Universal wafer carrier for wafer level die burn-in

Abstract

A reusable burn-in/test fixture for testing unsingulated dice on a semiconductor wafer consisting of two halves. The first half of the test fixture is a wafer cavity plate for receiving the wafer, and the second half establishes electrical communication between the wafer and electrical testing equipment. A rigid substrate has conductors thereon which establish electrical contact with the wafer. The test fixture need not be opened until the burn-in and electrical testing are completed. After burn-in stress and electrical testing, it is possible to establish interconnection between the single die or separate and package dice into discrete parts, arrays or clusters, either as singulated parts or as arrays.

1 . A wafer testing apparatus comprising: 
 a first rigid support member and a second rigid support member for receiving a plurality of semiconductor dice on a wafer therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining the plurality of semiconductor dice on a wafer therein during testing;    a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;    a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with the single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the plurality of semiconductor dice on a wafer towards the plurality of contact members, the single floating platform directly supporting the wafer with the elastomeric member sandwiched between the single floating platform and the second rigid support member.    
   
   
       2 . The apparatus as claimed in  claim 1 , further comprising an alignment device for aligning the first rigid support member and the second rigid support member with one another.  
   
   
       3 . The apparatus as claimed in  claim 1 , further comprising an alignment device including a dowel on one of the first rigid support member and the second rigid support member and a corresponding opening on the other of the first rigid support member and the second rigid support member.  
   
   
       4 . A testing apparatus for use with wafers comprising: 
 a first rigid support member and a second rigid support member for receiving a plurality of semiconductor dice on a wafer therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining the plurality of semiconductor dice on a wafer therein during testing;    a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;    a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with the single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the plurality of semiconductor dice on a wafer towards the plurality of contact members, the single floating platform directly supporting the wafer with the elastomeric member sandwiched between the single floating platform and the second rigid support member.    
   
   
       5 . The apparatus as claimed in  claim 4 , further comprising an alignment device for aligning the first rigid support member and the second rigid support member with one another.  
   
   
       6 . The apparatus as claimed in  claim 4 , further comprising an alignment device including a dowel on one of the first rigid support member and second rigid support member and a corresponding opening on the other of the first rigid support member and the second rigid support member.  
   
   
       7 . A testing apparatus comprising: 
 a first rigid support member and a second rigid support member for receiving a plurality of semiconductor dice on a wafer therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining the plurality of semiconductor dice on a wafer therein during testing;    a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;    a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with the single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the plurality of semiconductor dice on a wafer towards the plurality of contact members, the single floating platform directly supporting the wafer with the elastomeric member sandwiched between the single floating platform and the second rigid support member.    
   
   
       8 . The apparatus as claimed in  claim 7 , further comprising an alignment device for aligning the first rigid support member and the second rigid support member with one another.  
   
   
       9 . The apparatus as claimed in  claim 7 , further comprising an alignment device including a dowel on one of the first rigid support member and the second rigid support member and a corresponding opening on the other of the first rigid support member and the second rigid support member.  
   
   
       10 . A semiconductor dice testing apparatus comprising: 
 a first rigid support member and a second rigid support member for receiving a plurality of semiconductor dice on a wafer therebetween, one of the first rigid support member and second rigid support member including a single cavity for retaining the plurality of semiconductor dice on a wafer therein during testing;    a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;    a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with the single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the plurality of semiconductor dice on a wafer towards the plurality of contact members, the single floating platform directly supporting the wafer with the elastomeric member sandwiched between the single floating platform and the second rigid support member.    
   
   
       11 . The apparatus as claimed in  claim 10 , further comprising an alignment device for aligning the first rigid support member and the second rigid support member with one another.  
   
   
       12 . The apparatus as claimed in  claim 10 , further comprising an alignment device including a dowel on one of the first rigid support member and second rigid support member and a corresponding opening on the other of the first rigid support member and the second rigid support member.  
   
   
       13 . A testing apparatus for semiconductor dice in wafer form comprising: 
 a first rigid support member and a second rigid support member for receiving a plurality of semiconductor dice on a wafer therebetween, one of the first rigid support member and the second rigid support member including a single cavity for retaining the plurality of semiconductor dice on a wafer therein during testing;    a plurality of contact members formed on the first rigid support member for communicating with electrical connectors for connecting to external test circuitry;    a single biasing assembly including a single floating platform having a preselected area substantially sized to correspond with the single cavity and an elastomeric member disposed on the second rigid support member, the single biasing assembly sized for uniformly biasing the plurality of semiconductor dice on a wafer towards the plurality of contact members, the single floating platform directly supporting the wafer with the elastomeric member sandwiched between the single floating platform and the second rigid support member.    
   
   
       14 . The apparatus as claimed in  claim 13 , further comprising an alignment device for aligning the first rigid support member and the second rigid support member with one another.  
   
   
       15 . The apparatus as claimed in  claim 13 , further comprising an alignment device including a dowel on one of the first rigid support member and the second rigid support member and a corresponding opening on the other of the first rigid support member and the second rigid support member.