Inventor · disambiguated record
Alan G. Wood
Also filed as: WOOD ALAN · WOOD ALAN G
399 granted patents·23 pending applications·31,062 citations·filing 1988–2017
99Inventor score
Top patents by PatentIndex Score
422 records- 0199US8193646B2Semiconductor component having through wire interconnect (TWI) with compressed wireWOOD ALAN G·Filed 2010·Granted Jun 5, 2012·73 cites·4 claims
- 0299US7659612B2Semiconductor components having encapsulated through wire interconnects (TWI)MICRON TECHNOLOGY INC·Filed 2006·Granted Feb 9, 2010·75 cites·47 claims
- 0399US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0499US7393770B2Backside method for fabricating semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 1, 2008·130 cites·23 claims
- 0599US7307348B2Semiconductor components having through wire interconnects (TWI)MICRON TECHNOLOGY INC·Filed 2005·Granted Dec 11, 2007·91 cites·56 claims
- 0699US7221059B2Wafer level semiconductor component having thinned, encapsulated dice and polymer damMICRON TECHNOLOGY INC·Filed 2005·Granted May 22, 2007·61 cites·18 claims
- 0799US7029949B2Method for fabricating encapsulated semiconductor components having conductive viasMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·141 cites·37 claims
- 0899US6964915B2Method of fabricating encapsulated semiconductor components by etchingMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 15, 2005·150 cites·23 claims
- 0999US6908784B1Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·419 cites·75 claims
- 1099US6903443B2Semiconductor component and interconnect having conductive members and contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 7, 2005·246 cites·12 claims
- 1199US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 1299US6715018B2Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computerMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 30, 2004·220 cites·40 claims
- 1399US6620731B1Method for fabricating semiconductor components and interconnects with contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·293 cites·31 claims
- 1499US6614104B2Stackable semiconductor package having conductive layer and insulating layersMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 2, 2003·220 cites·30 claims
- 1599US6501165B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 31, 2002·249 cites·32 claims
- 1699US6359456B1Probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 19, 2002·149 cites·25 claims
- 1799US6235554B1Method for fabricating stackable chip scale semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·647 cites·25 claims
- 1899US6228687B1Wafer-level package and methods of fabricatingMICRON TECHNOLOGY INC·Filed 1999·Granted May 8, 2001·355 cites·50 claims
- 1999US6188232B1Temporary package, system, and method for testing semiconductor dice and chip scale packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 13, 2001·229 cites·12 claims
- 2099US6114240AMethod for fabricating semiconductor components using focused laser beamMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 5, 2000·522 cites·28 claims
- 2199US6107109AMethod for fabricating a semiconductor interconnect with laser machined electrical paths through substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·403 cites·30 claims
- 2299US6097087ASemiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 1, 2000·539 cites·6 claims
- 2399US6060891AProbe card for semiconductor wafers and method and system for testing wafersMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·218 cites·21 claims
- 2499US6020629AStacked semiconductor package and method of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·621 cites·23 claims
- 2599US6013948AStackable chip scale semiconductor package with mating contacts on opposed surfacesMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 11, 2000·684 cites·27 claims
- 2699US5869974AMicromachined probe card having compliant contact members for testing semiconductor wafersMICRON TECHNOLOGY INC·Filed 1996·Granted Feb 9, 1999·259 cites·27 claims
- 2799US5739585ASingle piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·728 cites·30 claims
- 2899US5674785AMethod of producing a single piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 7, 1997·514 cites·41 claims
- 2999US5495667AMethod for forming contact pins for semiconductor dice and interconnectsMICRON TECHNOLOGY INC·Filed 1994·Granted Mar 5, 1996·538 cites·30 claims
- 3099US5483741AMethod for fabricating a self limiting silicon based interconnect for testing bare semiconductor diceMICRON TECHNOLOGY INC·Filed 1994·Granted Jan 16, 1996·426 cites·29 claims
- 3199US4899107ADiscrete die burn-in for nonpackaged dieMICRON TECHNOLOGY INC·Filed 1988·Granted Feb 6, 1990·308 cites·16 claims
- 3298US7833832B2Method of fabricating semiconductor components with through interconnectsMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 16, 2010·56 cites·59 claims
- 3398US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 3498US7157353B2Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 2, 2007·38 cites·15 claims
- 3598US6828175B2Semiconductor component with backside contacts and method of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Dec 7, 2004·248 cites·27 claims
- 3698US6529027B1Interposer and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·118 cites·24 claims
- 3798US6465877B1Semiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 15, 2002·166 cites·28 claims
- 3898US6451624B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·220 cites·18 claims
- 3998US6368896B2Method of wafer level chip scale packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 9, 2002·267 cites·17 claims
- 4098US6310484B1Semiconductor test interconnect with variable flexure contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Oct 30, 2001·147 cites·15 claims
- 4198US6294837B1Semiconductor interconnect having laser machined contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·336 cites·21 claims
- 4298US6169329B1Semiconductor devices having interconnections using standardized bonding locations and methods of designingMICRON TECHNOLOGY INC·Filed 1996·Granted Jan 2, 2001·304 cites·38 claims
- 4398US6150717ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 21, 2000·296 cites·19 claims
- 4498US6107122ADirect die contact (DDC) semiconductor packageMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·286 cites·20 claims
- 4598US6094058ATemporary semiconductor package having dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Jul 25, 2000·173 cites·14 claims
- 4698US6020624ASemiconductor package with bi-substrate dieMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·304 cites·25 claims
- 4798US5990566AHigh density semiconductor packageMICRON TECHNOLOGY INC·Filed 1998·Granted Nov 23, 1999·317 cites·22 claims
- 4898US5946553AProcess for manufacturing a semiconductor package with bi-substrate dieMICRON TECHNOLOGY INC·Filed 1995·Granted Aug 31, 1999·351 cites·13 claims
- 4998US5851845AProcess for packaging a semiconductor die using dicing and testingMICRON TECHNOLOGY INC·Filed 1995·Granted Dec 22, 1998·456 cites·16 claims
- 5098USD402638STemporary package for semiconductor diceMICRON TECHNOLOGY INC·Filed 1997·Granted Dec 15, 1998·99 cites·1 claims
Showing the top 50 of 422 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →