Assignee
FARNWORTH WARREN M
US·11 granted patents·30 pending applications·50 citations·filing 2004–2012
Top patents by PatentIndex Score
41 records- 0193US7429529B2Methods of forming through-wafer interconnects and structures resulting therefromFARNWORTH WARREN M·Filed 2005·Granted Sep 30, 2008·25 cites·12 claims
- 0289US8597074B2Methods and systems for imaging and cutting semiconductor wafers and other semiconductor workpiecesFARNWORTH WARREN M·Filed 2011·Granted Dec 3, 2013·9 cites·16 claims
- 0379US8115269B2Integrated circuit package having reduced interconnectsFARNWORTH WARREN M·Filed 2010·Granted Feb 14, 2012·4 cites·18 claims
- 0476US8308053B2Microfeature workpieces having alloyed conductive structures, and associated methodsFARNWORTH WARREN M·Filed 2005·Granted Nov 13, 2012·5 cites·27 claims
- 0574US8637994B2Microfeature workpieces having alloyed conductive structures, and associated methodsFARNWORTH WARREN M·Filed 2012·Granted Jan 28, 2014·2 cites·16 claims
- 0663US8704380B2Methods for wafer-level packaging of microfeature devices and microfeature devices formed using such methodsFARNWORTH WARREN M·Filed 2010·Granted Apr 22, 2014·1 cites·16 claims
- 0760US8680680B2Semiconductor devices including porous insulatorsFARNWORTH WARREN M·Filed 2009·Granted Mar 25, 2014·0 cites·18 claims
- 0860US2007179655A1Methods and apparatus for calibrating programmable material consolidation apparatusFARNWORTH WARREN M·Filed 2007·Application pending·0 cites
- 0959US2007134359A1Apparatus for use in stereolithographic processing of components and assembliesFARNWORTH WARREN M·Filed 2007·Application pending·0 cites
- 1056US2007068996A1Continuous mode solder jet apparatusFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1155US2006163318A1Continuous mode solder jet apparatus and methodFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1255US2006226579A1Methods for removing gas and gas bubbles from liquid materials to be used in programmed material consolidation processesFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1354US8129839B2Electronic device package structuresFARNWORTH WARREN M·Filed 2005·Granted Mar 6, 2012·4 cites·25 claims
- 1454US8129847B2Interconnect and method for mounting an electronic device to a substrateFARNWORTH WARREN M·Filed 2009·Granted Mar 6, 2012·0 cites·13 claims
- 1553US2006226578A1Processes for facilitating removel of fabricated objects from platens of programmed material consolidation equipment, and fabrication processes employing the object release elementsFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1653US2007062511A1Group encapsulated dicing chuckFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1753US2007068504A1Group encapsulated dicing chuckFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1853US2007067064A1Surface level control systems and material recycling systems for use with programmable material consolidation apparatusFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 1953US2006234560A1Modular sockets using flexible interconnectsFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2053US2006231025A1Programmed material consolidation systems employing object release elements securable to platens for facilitating removal of fabricated objects therefromFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2152US2006115932A1Method for fabricating semiconductor components with conductive viasFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2251US2006003497A1Semiconductor device packages including hermetic packaging elements for at least partially encapsulating conductive elements and other package elements for protecting the portions of semiconductor devices not covered by the hermetic package elements, and packaging methodsFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 2351US2007048999A1Method for fabricating semiconductor component having conductors and bonding pads with wire bondable surfaces and selected thicknessFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2451US2006065262A1Group encapsulated dicing chuckFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 2551US2006168552A1Substrate mappingFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2651US2006254808A1Substrate precursor structuresFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2750US2006197235A1Electronic device components including protective layers on surfaces thereofFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 2850US2006022337A1Hermetic chip in wafer formFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 2950US2007123058A1Semiconductor device structures that include sacrificial, readily removable materialsFARNWORTH WARREN M·Filed 2007·Application pending·0 cites
- 3050US2007124012A1Programmed material consolidation methods employing machine visionFARNWORTH WARREN M·Filed 2007·Application pending·0 cites
- 3149US8569093B2Microelectronic devices and methods for manufacturing microelectronic devicesFARNWORTH WARREN M·Filed 2006·Granted Oct 29, 2013·0 cites·33 claims
- 3249US2006081966A1Chip-scale packagesFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 3348US2005268847A1Selective deposition system and method for initiating deposition at a defined starting surfaceFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 3448US2009139988A1System for creating more uniform distribution of microwave energy in a cavityFARNWORTH WARREN M·Filed 2007·Application pending·0 cites
- 3548US2005255675A1Apparatus for supporting wafers for die singulation and subsequent handling and in-process wafer structureFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 3645US2007018336A1Stress and force management techniques for a semiconductor dieFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 3742US2006211313A1Programmed material consolidation processes for fabricating electrical contacts and the resulting electrical contactsFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 3842US2006205291A1Methods for fabricating electronic device components that include protruding contacts and electronic device components so fabricatedFARNWORTH WARREN M·Filed 2006·Application pending·0 cites
- 3941US2005251282A1Method and apparatus for forming structures proximate to workpiecesFARNWORTH WARREN M·Filed 2005·Application pending·0 cites
- 4040US7515011B2Microwave routing element, methods of routing microwaves and systems including sameFARNWORTH WARREN M·Filed 2005·Granted Apr 7, 2009·0 cites·28 claims
- 4138US2005206012A1Stress and force management techniques for a semiconductor dieFARNWORTH WARREN M·Filed 2004·Application pending·0 cites
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