Apparatus for use in stereolithographic processing of components and assemblies

Abstract

An apparatus for providing gross location, planarization, and mechanical restraint to one or more electronic components such as semiconductor dice to be subjected to stereolithographic processing. A double platen assembly including a first platen and a second platen mutually removably connected and configured and arranged to substantially secure an electronic component assembly in position therebetween. At least one of the platens is configured such that a portion of electronic components of a carrier substrate secured by the double platen assembly is viewable for exposure to an energy beam such as a laser beam used to cure a liquid into an associated dielectric stereolithographic packaging structure. Another embodiment includes the use of an adhesive-coated film for holding, locating and securing a plurality of individual electronic components for processing. A method of forming solder balls is also disclosed.

1 . An apparatus for facilitating processing of a plurality of electronic components, comprising: 
 a frame member including frame alignment features configured for cooperative engagement with frame alignment elements projecting from a platform of a stereolithography apparatus;    a film suspended under tension within the frame member; and    an adhesive coating on the film, the adhesive coating formulated to exhibit adhesive characteristics reducible responsive to exposure to at least one selected wavelength of radiation.    
   
   
       2 . The apparatus of  claim 1 , wherein the at least one selected wavelength of radiation falls within a range of wavelengths in the ultraviolet band of wavelengths.  
   
   
       3 . An apparatus for fabrication of articles, comprising: 
 a stereolithography system structured for formation of material in at least a semisolid state in at least one layer to form a structure abutting a pre-existing workpiece located within a vision field above a platform of the stereolithography system, the platform having frame alignment elements projecting therefrom;    a machine vision system in operable communication with the stereolithography system including at least one camera oriented for detecting objects within the vision field;    a computer in operable communication with both the stereolithography system and the machine vision system, the computer being programmed to respond to input from the machine vision system indicative of the presence, location and orientation of at least one workpiece in the vision field and to initiate and control the stereolithography system to form at least one structure of at least one layer of an at least semisolid material abutting the at least one workpiece;    a frame member including frame alignment features cooperatively engaged with the frame alignment elements;    a film suspended under tension within the frame member; and    an adhesive coating on the film, the adhesive coating formulated to exhibit adhesive characteristics reducible responsive to exposure to at least one selected wavelength of radiation.    
   
   
       4 . The apparatus of  claim 3 , wherein the at least one selected wavelength of radiation falls within a range of wavelengths in the ultraviolet band of wavelengths.