Inventor · disambiguated record
Warren M. Farnworth
Also filed as: FARNWORTH WARREN · FARNWORTH WARREN M
776 granted patents·85 pending applications·47,249 citations·filing 1988–2019
99Inventor score
Files withMICRON TECHNOLOGY INC748FARNWORTH WARREN M41AKRAM SALMAN8APTINA IMAGING CORP7HIATT WILLIAM M5
Top patents by PatentIndex Score
861 records- 0199US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0299US7221059B2Wafer level semiconductor component having thinned, encapsulated dice and polymer damMICRON TECHNOLOGY INC·Filed 2005·Granted May 22, 2007·61 cites·18 claims
- 0399US7029949B2Method for fabricating encapsulated semiconductor components having conductive viasMICRON TECHNOLOGY INC·Filed 2003·Granted Apr 18, 2006·141 cites·37 claims
- 0499US7026835B2Engagement probe having a grouping of projecting apexes for engaging a conductive padMICRON TECHNOLOGY INC·Filed 2002·Granted Apr 11, 2006·109 cites·16 claims
- 0599US6964915B2Method of fabricating encapsulated semiconductor components by etchingMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 15, 2005·150 cites·23 claims
- 0699US6908784B1Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 21, 2005·419 cites·75 claims
- 0799US6903443B2Semiconductor component and interconnect having conductive members and contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Jun 7, 2005·246 cites·12 claims
- 0899US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 0999US6715018B2Computer including installable and removable cards, optical interconnection between cards, and method of assembling a computerMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 30, 2004·220 cites·40 claims
- 1099US6620731B1Method for fabricating semiconductor components and interconnects with contacts on opposing sidesMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 16, 2003·293 cites·31 claims
- 1199US6614104B2Stackable semiconductor package having conductive layer and insulating layersMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 2, 2003·220 cites·30 claims
- 1299US6501165B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 31, 2002·249 cites·32 claims
- 1399US6359456B1Probe card and test system for semiconductor wafersMICRON TECHNOLOGY INC·Filed 2001·Granted Mar 19, 2002·149 cites·25 claims
- 1499US6326697B1Hermetically sealed chip scale packages formed by wafer level fabrication and assemblyMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 4, 2001·301 cites·6 claims
- 1599US6235554B1Method for fabricating stackable chip scale semiconductor packageMICRON TECHNOLOGY INC·Filed 1999·Granted May 22, 2001·647 cites·25 claims
- 1699US6188232B1Temporary package, system, and method for testing semiconductor dice and chip scale packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 13, 2001·229 cites·12 claims
- 1799US6124634AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 26, 2000·328 cites·30 claims
- 1899US6114240AMethod for fabricating semiconductor components using focused laser beamMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 5, 2000·522 cites·28 claims
- 1999US6107109AMethod for fabricating a semiconductor interconnect with laser machined electrical paths through substrateMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 22, 2000·403 cites·30 claims
- 2099US6097087ASemiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 1997·Granted Aug 1, 2000·539 cites·6 claims
- 2199US6072236AMicromachined chip scale packageMICRON TECHNOLOGY INC·Filed 1996·Granted Jun 6, 2000·520 cites·49 claims
- 2299US6060891AProbe card for semiconductor wafers and method and system for testing wafersMICRON TECHNOLOGY INC·Filed 1997·Granted May 9, 2000·218 cites·21 claims
- 2399US6028365AIntegrated circuit package and method of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 22, 2000·563 cites·27 claims
- 2499US6025728ASemiconductor package with wire bond protective memberMICRON TECHNOLOGY INC·Filed 1997·Granted Feb 15, 2000·230 cites·24 claims
- 2599US6020629AStacked semiconductor package and method of fabricationMICRON TECHNOLOGY INC·Filed 1998·Granted Feb 1, 2000·621 cites·23 claims
- 2699US6013948AStackable chip scale semiconductor package with mating contacts on opposed surfacesMICRON TECHNOLOGY INC·Filed 1998·Granted Jan 11, 2000·684 cites·27 claims
- 2799US6008070AWafer level fabrication and assembly of chip scale packagesMICRON TECHNOLOGY INC·Filed 1998·Granted Dec 28, 1999·336 cites·60 claims
- 2899US5933713AMethod of forming overmolded chip scale package and resulting productMICRON TECHNOLOGY INC·Filed 1998·Granted Aug 3, 1999·373 cites·34 claims
- 2999US5739585ASingle piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1996·Granted Apr 14, 1998·728 cites·30 claims
- 3099US5674785AMethod of producing a single piece package for semiconductor dieMICRON TECHNOLOGY INC·Filed 1995·Granted Oct 7, 1997·514 cites·41 claims
- 3199US5495667AMethod for forming contact pins for semiconductor dice and interconnectsMICRON TECHNOLOGY INC·Filed 1994·Granted Mar 5, 1996·538 cites·30 claims
- 3299US5483741AMethod for fabricating a self limiting silicon based interconnect for testing bare semiconductor diceMICRON TECHNOLOGY INC·Filed 1994·Granted Jan 16, 1996·426 cites·29 claims
- 3399US5484314AMicro-pillar fabrication utilizing a stereolithographic printing processMICRON SEMICONDUCTOR INC·Filed 1994·Granted Jan 16, 1996·240 cites·20 claims
- 3499US5326428AMethod for testing semiconductor circuitry for operability and method of forming apparatus for testing semiconductor circuitry for operabilityMICRON SEMICONDUCTOR INC·Filed 1993·Granted Jul 5, 1994·327 cites·20 claims
- 3599US5012323ADouble-die semiconductor package having a back-bonded die and a face-bonded die interconnected on a single leadframeMICRON TECHNOLOGY INC·Filed 1989·Granted Apr 30, 1991·405 cites·1 claims
- 3698US7833832B2Method of fabricating semiconductor components with through interconnectsMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 16, 2010·56 cites·59 claims
- 3798US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 3898US7411304B2Semiconductor interconnect having conductive spring contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 12, 2008·63 cites·19 claims
- 3998US7157353B2Method for fabricating encapsulated semiconductor componentsMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 2, 2007·38 cites·15 claims
- 4098US6906418B2Semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·140 cites·29 claims
- 4198US6794699B2Annular gate and technique for fabricating an annular gateMICRON TECHNOLOGY INC·Filed 2002·Granted Sep 21, 2004·172 cites·107 claims
- 4298US6549821B1Stereolithographic method and apparatus for packaging electronic components and resulting structuresMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 15, 2003·145 cites·60 claims
- 4398US6529027B1Interposer and methods for fabricating sameMICRON TECHNOLOGY INC·Filed 2000·Granted Mar 4, 2003·118 cites·24 claims
- 4498US6515325B1Nanotube semiconductor devices and methods for making the sameMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 4, 2003·175 cites·14 claims
- 4598US6465877B1Semiconductor package including flex circuit, interconnects and dense array external contactsMICRON TECHNOLOGY INC·Filed 2000·Granted Oct 15, 2002·166 cites·28 claims
- 4698US6451624B1Stackable semiconductor package having conductive layer and insulating layers and method of fabricationMICRON TECHNOLOGY INC·Filed 2001·Granted Sep 17, 2002·220 cites·18 claims
- 4798US6368896B2Method of wafer level chip scale packagingMICRON TECHNOLOGY INC·Filed 1999·Granted Apr 9, 2002·267 cites·17 claims
- 4898US6294837B1Semiconductor interconnect having laser machined contactsMICRON TECHNOLOGY INC·Filed 1999·Granted Sep 25, 2001·336 cites·21 claims
- 4998US6291894B1Method and apparatus for a semiconductor package for vertical surface mountingMICRON TECHNOLOGY INC·Filed 1998·Granted Sep 18, 2001·293 cites·5 claims
- 5098US6285204B1Method for testing semiconductor packages using oxide penetrating test contactsMICRON TECHNOLOGY INC·Filed 2000·Granted Sep 4, 2001·131 cites·24 claims
Showing the top 50 of 861 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →