Continuous mode solder jet apparatus

Abstract

A solder jet apparatus is disclosed. The solder jet apparatus is a continuous mode solder jet that includes a blanking system and raster scan system. The use of the raster scan and blanking systems allows for a continuous stream of solder to be placed anywhere on the surface in any desired X-Y plane. This allows for greater accuracy as well as greater product throughput. Additionally, with the raster scan system, repairs to existing soldered surfaces can be quickly and easily performed using a map of the defects for directing the solder to the defects.

1 . A liquid metal deposition apparatus comprising: 
 a continuous stream generator for producing a stream of liquid metal solder droplets, the liquid metal solder droplets having a substantially uniform size within a consistent predetermined range, the consistent predetermined range of substantially uniform size metal solder droplets being within a size of a selected bond pad of one of a semiconductor die and contact pads of a substrate; and    a director for selectively directing a stream of liquid metal solder droplets after being produced by the continuous stream generator onto the selected bond pads of the semiconductor die of the substrate, the stream director including a raster scanner for scanning the stream of liquid metal solder droplets, the raster scanner including: 
 an electrical charge generator for charging at least a portion of the liquid metal solder droplets of the stream of liquid metal solder droplets with an electrical charge;  
 a stream blanking device for intermittently blanking at least some of the liquid metal solder droplets of the stream of liquid metal solder droplets; and  
 an electrically charged droplet deflector for deflecting at least one electrically charged liquid metal solder droplet of the stream of liquid metal solder droplets in a first direction and a second direction for deposition at a location of a plurality of locations extending throughout the surface of the substrate while the substrate remains stationary.  
   
   
   
       2 . The apparatus according to  claim 1 , wherein the continuous stream generator comprises: 
 a pressure inducer; and    the vibrator comprises a vibrator connected to the pressure inducer for causing formation of the stream of liquid metal solder droplets in connection with the pressure inducer.    
   
   
       3 . The apparatus according to  claim 2 , wherein the pressure inducer comprises a piezoelectric crystal operating at a desired frequency.  
   
   
       4 . The apparatus according to  claim 2 , wherein the vibrator comprises a piezoelectric crystal operating at a selected frequency to form liquid metal droplets having a size in the range of micron size droplets of a liquid metal solder.  
   
   
       5 . The apparatus according to  claim 1 , wherein the continuous stream generator includes a solder jet nozzle having an aperture producing a consistent range of droplets of the liquid metal solder for forming the stream of liquid metal solder droplets.  
   
   
       6 . The apparatus according to  claim 5 , wherein the continuous stream generator further includes a solenoid connected to the solder jet nozzle.  
   
   
       7 . The apparatus according to  claim 1 , wherein the stream blanking device at least provides blanking of the at least some of the stream of liquid metal solder droplets when the stream of liquid metal solder droplets is positioned between the endpoint of a first location of the plurality of locations extending throughout the surface of the substrate and the start point of a second location of the plurality of locations extending throughout the surface of the substrate.  
   
   
       8 . The apparatus according to  claim 1 , wherein the stream blanking device comprises: 
 a deflector field device selectively deflecting at least one droplet of the stream of liquid metal solder droplets; and    a droplet catcher catching the at least one droplet which has been deflected from the stream of liquid metal solder droplets prior to the at least one droplet which has been deflected from the stream of liquid solder droplets being deposited on at least one bond pad of the semiconductor die of the substrate.    
   
   
       9 . The apparatus according to  claim 1 , wherein the stream director includes a programmable direction controller for determining a direction of the stream of liquid metal solder droplets.  
   
   
       10 . A deposition apparatus comprising: 
 a continuous stream generator for producing a stream of liquid metal solder droplets, the liquid metal solder droplets having a substantially uniform size within a consistent predetermined range, the consistent predetermined range of substantially uniform size metal solder droplets being within a size of a selected bond pad of one of a semiconductor die and contact pads of a substrate; and    a director for selectively directing a stream of liquid metal solder droplets after being produced by the continuous stream generator onto the selected bond pads of the semiconductor die of the substrate, the stream director including a raster scanner for scanning the stream of liquid metal solder droplets, the raster scanner including: 
 an electrical charge generator for charging at least a portion of the liquid metal solder droplets of the stream of liquid metal solder droplets with an electrical charge;  
 a stream blanking device for intermittently blanking at least some of the liquid metal solder droplets of the stream of liquid metal solder droplets; and  
 an electrically charged droplet deflector for deflecting at least one electrically charged liquid metal solder droplet of the stream of liquid metal solder droplets in a first direction and a second direction for deposition at a location of a plurality of locations extending throughout the surface of the substrate while the substrate remains stationary.  
   
   
   
       11 . The apparatus according to  claim 10 , wherein the continuous stream generator comprises: 
 a pressure inducer; and    the vibrator comprises a vibrator connected to the pressure inducer for causing formation of the stream of liquid metal solder droplets in connection with the pressure inducer.    
   
   
       12 . The apparatus according to  claim 11 , wherein the pressure inducer comprises a piezoelectric crystal operating at a desired frequency.  
   
   
       13 . The apparatus according to  claim 11 , wherein the vibrator comprises a piezoelectric crystal operating at a selected frequency to form liquid metal droplets having a size in the range of micron size droplets of a liquid metal solder.  
   
   
       14 . The apparatus according to  claim 10 , wherein the continuous stream generator includes a solder jet nozzle having an aperture producing a consistent range of droplets of the liquid metal solder for forming the stream of liquid metal solder droplets.  
   
   
       15 . The apparatus according to  claim 14 , wherein the continuous stream generator further includes a solenoid connected to the solder jet nozzle.  
   
   
       16 . The apparatus according to  claim 10 , wherein the stream blanking device at least provides blanking of the at least some of the stream of liquid metal solder droplets when the stream of liquid metal solder droplets is positioned between the endpoint of a first location of the plurality of locations extending throughout the surface of the substrate and the start point of a second location of the plurality of locations extending throughout the surface of the substrate.  
   
   
       17 . The apparatus according to  claim 10 , wherein the stream blanking device comprises: 
 a deflector field device selectively deflecting at least one droplet of the stream of liquid metal solder droplets; and    a droplet catcher catching the at least one droplet which has been deflected from the stream of liquid metal solder droplets prior to the at least one droplet which has been deflected from the stream of liquid solder droplets being deposited on at least one bond pad of the semiconductor die of the substrate.    
   
   
       18 . The apparatus according to  claim 10 , wherein the stream director includes a programmable direction controller for determining a direction of the stream of liquid metal solder droplets.  
   
   
       19 . A liquid deposition apparatus comprising: 
 a continuous stream generator for producing a stream of liquid metal solder droplets, the liquid metal solder droplets having a substantially uniform size within a consistent predetermined range, the consistent predetermined range of substantially uniform size metal solder droplets being within a size of a selected bond pad of one of a semiconductor die and contact pads of a substrate; and    a director for selectively directing a stream of liquid metal solder droplets after being produced by the continuous stream generator onto the selected bond pads of the semiconductor die of the substrate, the stream director including a raster scanner for scanning the stream of liquid metal solder droplets, the raster scanner including: 
 an electrical charge generator for charging at least a portion of the liquid metal solder droplets of the stream of liquid metal solder droplets with an electrical charge;  
 a stream blanking device for intermittently blanking at least some of the liquid metal solder droplets of the stream of liquid metal solder droplets; and  
 an electrically charged droplet deflector for deflecting at least one electrically charged liquid metal solder droplet of the stream of liquid metal solder droplets in a first direction and a second direction for deposition at a location of a plurality of locations extending throughout the surface of the substrate while the substrate remains stationary.  
   
   
   
       20 . The apparatus according to  claim 19 , wherein the continuous stream generator comprises: 
 a pressure inducer; and    the vibrator comprises a vibrator connected to the pressure inducer for causing formation of the stream of liquid metal solder droplets in connection with the pressure inducer.    
   
   
       21 . The apparatus according to  claim 19 , wherein the pressure inducer comprises a piezoelectric crystal operating at a desired frequency.  
   
   
       22 . The apparatus according to  claim 21 , wherein the vibrator comprises a piezoelectric crystal operating at a selected frequency to form liquid metal droplets having a size in the range of micron size droplets of a liquid metal solder.  
   
   
       23 . The apparatus according to  claim 19 , wherein the continuous stream generator includes a solder jet nozzle having an aperture producing a consistent range of droplets of the liquid metal solder for forming the stream of liquid metal solder droplets.  
   
   
       24 . The apparatus according to  claim 23 , wherein the continuous stream generator further includes a solenoid connected to the solder jet nozzle.  
   
   
       25 . The apparatus according to  claim 19 , wherein the stream blanking device at least provides blanking of the at least some of the stream of liquid metal solder droplets when the stream of liquid metal solder droplets is positioned between the endpoint of a first location of the plurality of locations extending throughout the surface of the substrate and the start point of a second location of the plurality of locations extending throughout the surface of the substrate.  
   
   
       26 . The apparatus according to  claim 19 , wherein the stream blanking device comprises: 
 a deflector field device selectively deflecting at least one droplet of the stream of liquid metal solder droplets; and    a droplet catcher catching the at least one droplet which has been deflected from the stream of liquid metal solder droplets prior to the at least one droplet which has been deflected from the stream of liquid solder droplets being deposited on at least one bond pad of the semiconductor die of the substrate.    
   
   
       27 . The apparatus according to  claim 19 , wherein the stream director includes a programmable direction controller for determining a direction of the stream of liquid metal solder droplets.