Electronic device components including protective layers on surfaces thereof

Abstract

An electronic device component, such as a semiconductor element device or semiconductor device component includes on selected portions of a surface thereof. One or more conductive features may be exposed through the protective element. The protective element includes a plurality of adjacent, mutually adhered regions. The adjacent, mutually adhered regions may comprise the same material. They may be substantially free of voids or air pockets. The electronic device may be an individual component or it may be physically secured to one or more other components, such as devices that have yet to be singulated from a large-scale substrate, such as a full or partial wafer or a strip or array of carriers.

1 . In combination, a substrate including a plurality of components and a protective element on selected portions of at least one component of the plurality, the protective element including a plurality of adjacent, mutually adhered regions comprising the same material.  
   
   
       2 . The combination of  claim 1 , wherein the substrate carries the plurality of components.  
   
   
       3 . The combination of  claim 2 , wherein at least one component of the plurality comprises a semiconductor device.  
   
   
       4 . The combination of  claim 1 , wherein the substrate comprises a semiconductor substrate.  
   
   
       5 . The combination of  claim 1 , wherein the protective element is substantially discontinuous from protective elements on adjacent components of the plurality.  
   
   
       6 . The combination of  claim 1 , wherein the protective element comprises at least one of a curable polymer, a thermoplastic material, and an adhesive.  
   
   
       7 . The combination of  claim 1 , wherein the protective element substantially covers a surface of a corresponding component of the plurality.  
   
   
       8 . The combination of  claim 7 , wherein each protective element substantially covers a surface of a corresponding component of the plurality.  
   
   
       9 . The combination of  claim 1 , wherein conductors of the at least one component are exposed through the protective element.  
   
   
       10 . The combination of  claim 9 , wherein the conductors comprise contact pads.  
   
   
       11 . An electronic component, comprising: 
 a substrate with at least one conductor on a surface thereof; and    a plurality of adjacent, mutually adhered regions comprising of at least semisolid dielectric material on the surface, the plurality adjacent, mutually adhered regions being substantially free of voids and air pockets, the at least one conductor being electrically exposed through the plurality of adjacent, mutually adhered regions.    
   
   
       12 . The electronic component of  claim 11 , wherein the at least one conductor is laterally surrounded by the at least semisolid dielectric material.  
   
   
       13 . The electronic component of  claim 12 , wherein the at least one conductor is recessed beneath an outer surface of the plurality of adjacent, mutually adhered regions.  
   
   
       14 . The electronic component of  claim 11 , wherein an outer surface of the plurality of adjacent, mutually adhered regions is substantially planar.  
   
   
       15 . The electronic component of  claim 11 , wherein an outer surface of the plurality of adjacent, mutually adhered regions is substantially parallel to the surface of the substrate.  
   
   
       16 . The electronic component of  claim 11 , wherein the substrate comprises at least one semiconductor die.  
   
   
       17 . The electronic component of  claim 11 , wherein the substrate carries a plurality of components.  
   
   
       18 . The electronic component of  claim 17 , wherein the substrate comprises a large-scale fabrication substrate.  
   
   
       19 . The electronic component of  claim 17 , wherein the at least semisolid dielectric material does not reside over streets located between adjacent components.  
   
   
       20 . The electronic component of  claim 11 , comprising an adhesive material  
   
   
       21 . The electronic component of  claim 20 , wherein the plurality of adjacent, mutually adhered regions comprises the adhesive material.  
   
   
       22 . The electronic component of  claim 20 , wherein the adhesive material is on at least a portion of an outer surface of the plurality of adjacent, mutually adhered regions.  
   
   
       23 . The electronic component of  claim 20 , wherein the adhesive material comprises thermoplastic material.  
   
   
       24 . The electronic component of  claim 11 , wherein all regions of the plurality of adjacent, mutually adhered regions comprise the same material.