Method and apparatus for forming structures proximate to workpieces

Abstract

A method and apparatus for applying packaging material to workpieces, with a high degree of precision, and resulting articles. A machine vision system including at least one camera is operably associated with a computer controlling a system for application of material so that the system may recognize the position and orientation of workpieces proximate to which the material is to be applied. The requirement for precise mechanical workpiece alignment is eliminated, and the ability of the machine vision system to recognize size, configuration and topography of different workpieces affords greater manufacturing flexibility. The method includes application of flowable material in separate volumes and draws formation of the material to at least a semisolid state for packaging electronic components, and the electronic components so packaged are also part of the invention.

1 . A method of fabrication of articles, comprising: 
 placing a plurality of workpieces at a common horizontal plane;    recognizing a presence, location and orientation of each workpiece of the plurality; and    using the recognized location and orientation of each workpiece of the plurality, mutually adjoined forming a structure comprising a plurality of segrments of at least semisolid material by selectively transforming separate volumes of a curable flowable material to at least a semisolid state at locations proximate each of the plurality of workpieces.    
   
   
       2 . The method of  claim 1 , further comprising storing data including at least one physical parameter of the workpieces in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the workpieces.  
   
   
       3 . The method of  claim 2 , further comprising using the stored data, in conjunction with the machine vision system, to selectively form at least one segment of the plurality of segments of the at least semisolid material over at least one portion of an upper surface of each of the workpieces of the plurality.  
   
   
       4 . The method of  claim 1 , further comprising using the stored data, in conjunction with the machine vision system, to form sidewalls comprising at least one segment of the at least semisolid material about each of the workpieces of the plurality.  
   
   
       5 . The method of  claim 1 , wherein the workpieces of the plurality comprise semiconductor dice, and further including securing the plurality of semiconductor dice to lead frames of a lead frame strip prior to placing the plurality of semiconductor dice at the common horizontal plane.  
   
   
       6 . The method of  claim 1 , wherein the workpieces of the plurality comprise semiconductor dice, and further including securing each semiconductor die of the plurality to a carrier substrate prior to placing the plurality of semiconductor dice at the common horizontal plane.  
   
   
       7 . The method of  claim 1 , further comprising, after forming the structure comprising a plurality of segments of at least semisolid material: 
 inverting the plurality of workpieces and placing the plurality of workpieces at a common horizontal plane;    recognizing a location and orientation of each inverted workpiece of the plurality; and    forming another structure comprising at least one segment of at least semisolid material abutting each of the plurality of workpieces.    
   
   
       8 . The method of  claim 7 , further comprising storing data including at least one physical parameter of the workpieces in computer memory, and using the stored data in conjunction with a machine vision system to recognize the location and orientation of the workpieces.  
   
   
       9 . The method of  claim 8 , further comprising using the stored data, in conjunction with the machine vision system, to selectively form the at least one segment of semisolid material of the another structure on at least one portion of an upper surface of each of the workpieces of the plurality.  
   
   
       10 . The method of  claim 8 , further comprising using the stored data, in conjunction with the machine vision system, to sequentially form sidewalls comprising a plurality of at least partially superimposed, contiguous, mutually adhered segments of the at least semisolid material about each of the workpieces of the plurality.  
   
   
       11 . The method of  claim 7 , wherein the plurality of workpieces comprises semiconductor dice, and further including securing the plurality of semiconductor dice to lead frames of a lead frame strip prior to placing the plurality of semiconductor dice at the common horizontal plane.  
   
   
       12 . The method of  claim 7 , wherein the plurality of workpieces comprises semiconductor dice, and further including securing each semiconductor die of the plurality to a carrier substrate prior to placing the plurality of semiconductor dice at the common horizontal plane.  
   
   
       13 . An apparatus for fabrication of articles, comprising: 
 a material disposition system structured for selective transformation of portions of material in a flowable state to at least a semisolid state;    a machine vision system in operable communication with the material disposition system including at least one camera oriented for detecting objects within the vision field;    a computer in operable communication with both the material disposition system and the machine vision system, the computer being programmed to respond to input from the machine vision system indicative of a presence, location and orientation of at least one workpiece in the vision field and to initiate and control the material disposition system to selectively transform portions of material in a flowable state to at least a semisolid state responsive to the input and relative to the presence, location and orientation of the at least one workpiece to form at least one structure comprising a plurality of segments of at least semisolid material proximate the at least one workpiece.    
   
   
       14 . The apparatus of  claim 13 , further including memory in operable communication with the computer, wherein the memory includes at least one data file representative of at least one physical parameter of the at least one workpiece, and the computer is programmed to employ the at least one data file at least in part to determine the presence, location and orientation of the at least one workpiece in the vision field.  
   
   
       15 . The apparatus of  claim 14 , wherein the computer is programmed to employ the at least one data file at least in part to select a location and configuration of the at least one structure formed proximate the at least one workpiece.  
   
   
       16 . The apparatus of  claim 15 , wherein the computer is programmed to employ the at least one data file at least in part to detect a presence of a physically defective workpiece in the vision field.  
   
   
       17 . The apparatus of  claim 16 , wherein the at least one workpiece comprises a plurality of workpieces disposed at a common horizontal plane.  
   
   
       18 . The apparatus of  claim 17 , wherein the plurality of workpieces each have at least one differing physical parameter, and the at least one data file comprises a plurality of data files, each data file of the plurality representative of the at least one differing physical parameter, and the computer is programmed to employ the plurality of data files at least in part to recognize the plurality of workpieces differing in at least one physical parameter as being different.