Substrate precursor structures

Abstract

Substrate precursor structures include a substrate blank having at least one aperture extending substantially through the substrate blank. At least a portion of at least one conductive layer covers a surface of the at least one aperture of the substrate blank. A mask pattern covers a portion of the at least one conductive layer and exposes another portion of the at least one conductive layer to define at least one conductive element, at least a portion of which extends over the surface of the at least one aperture.

1 . A substrate precursor structure, comprising: 
 at least one substrate blank having a surface and another, opposing surface;    at least one aperture extending substantially through the at least one substrate blank between the surface and the another, opposing surface; and    at least one conductive layer covering the surface, the another opposing surface and a surface of the at least one aperture of the at least one substrate blank;    a mask pattern covering a portion of the at least one conductive layer and exposing another portion of the at least one conductive layer to define at least one conductive element on the exposed another portion of the at least one conductive layer extending over a portion of at least one of the surface and the another, opposing surface and over the surface of the at least one aperture; and    a conductive layer of a metal only on the exposed another portion of the at least one conductive layer.    
   
   
       2 . The substrate precursor structure of  claim 1 , wherein the at least one conductive layer comprises polysilicon.  
   
   
       3 . The substrate precursor structure of  claim 1 , wherein the at least one conductive layer comprises a metal other than the metal of the conductive layer thereover.  
   
   
       4 . The substrate precursor structure of  claim 3 , wherein the at least one conductive layer comprises copper.  
   
   
       5 . The substrate precursor structure of  claim 4 , wherein the conductive layer of a metal comprises nickel or an alloy thereof.  
   
   
       6 . The substrate precursor structure of  claim 1 , wherein the at least one conductive layer comprises copper, nickel, or an alloy thereof.  
   
   
       7 . The substrate precursor structure of  claim 1 , wherein the at least one substrate blank comprises gallium arsenide, indium phosphide, silicon, a ceramic, a polymer or a photoetchable glass.  
   
   
       8 . The substrate precursor structure of  claim 1 , further including a dielectric layer over the surface, the another, opposing surface and the surface of the at least one aperture of the at least one substrate blank under the at least one conductive layer.