Inventor · disambiguated record
William M. Hiatt
Also filed as: HIATT WILLIAM M · HIATT WILLIAM MARK · KIRBY KYLE K
118 granted patents·24 pending applications·3,053 citations·filing 1997–2024
99Inventor score
Files withMICRON TECHNOLOGY INC96FARNWORTH WARREN M8HIATT WILLIAM M8AKRAM SALMAN7APTINA IMAGING CORP5
Top patents by PatentIndex Score
142 records- 0199US7498675B2Semiconductor component having plate, stacked dice and conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 3, 2009·292 cites·20 claims
- 0299US7393770B2Backside method for fabricating semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2005·Granted Jul 1, 2008·130 cites·23 claims
- 0399US6841883B1Multi-dice chip scale semiconductor components and wafer level methods of fabricationMICRON TECHNOLOGY INC·Filed 2003·Granted Jan 11, 2005·659 cites·71 claims
- 0498US7683458B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 23, 2010·54 cites·17 claims
- 0598US6906418B2Semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 14, 2005·140 cites·29 claims
- 0697US7951702B2Methods for fabricating semiconductor components with conductive interconnects having planar surfacesMICRON TECHNOLOGY INC·Filed 2010·Granted May 31, 2011·24 cites·19 claims
- 0797US7603772B2Methods of fabricating substrates including one or more conductive viasMICRON TECHNOLOGY INC·Filed 2007·Granted Oct 20, 2009·41 cites·16 claims
- 0897US7531453B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2008·Granted May 12, 2009·45 cites·19 claims
- 0997US7262134B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Aug 28, 2007·59 cites·32 claims
- 1096US7829976B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2009·Granted Nov 9, 2010·31 cites·22 claims
- 1196US7727872B2Methods for fabricating semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2008·Granted Jun 1, 2010·26 cites·15 claims
- 1296US7452743B2Microelectronic imaging units and methods of manufacturing microelectronic imaging units at the wafer levelAPTINA IMAGING CORP·Filed 2005·Granted Nov 18, 2008·52 cites·34 claims
- 1396US7232754B2Microelectronic devices and methods for forming interconnects in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2004·Granted Jun 19, 2007·84 cites·41 claims
- 1496US7199050B2Pass through via technology for use during the manufacture of a semiconductor deviceMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 3, 2007·92 cites·20 claims
- 1596US6803303B1Method of fabricating semiconductor component having encapsulated, bonded, interconnect contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 12, 2004·80 cites·47 claims
- 1695US6673649B1Microelectronic device packages and methods for controlling the disposition of non-conductive materials in such packagesMICRON TECHNOLOGY INC·Filed 2002·Granted Jan 6, 2004·92 cites·22 claims
- 1794US7935991B2Semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2008·Granted May 3, 2011·20 cites·60 claims
- 1894US7863187B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 4, 2011·22 cites·39 claims
- 1993US8253230B2Disabling electrical connections using pass-through 3D interconnects and associated systems and methodsJANZEN JEFFERY W·Filed 2008·Granted Aug 28, 2012·22 cites·10 claims
- 2092US11476160B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2020·Granted Oct 18, 2022·2 cites·20 claims
- 2192US7915736B2Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 29, 2011·21 cites·24 claims
- 2292US7768096B2System for fabricating semiconductor components with conductive interconnectsMICRON TECHNOLOGY INC·Filed 2008·Granted Aug 3, 2010·15 cites·21 claims
- 2392US7719120B2Multi-component integrated circuit contactsMICRON TECHNOLOGY INC·Filed 2006·Granted May 18, 2010·17 cites·29 claims
- 2492US7459393B2Method for fabricating semiconductor components with thinned substrate, circuit side contacts, conductive vias and backside contactsMICRON TECHNOLOGY INC·Filed 2006·Granted Dec 2, 2008·58 cites·15 claims
- 2592US7446028B2Multi-component integrated circuit contactsMICRON TECHNOLOGY INC·Filed 2005·Granted Nov 4, 2008·16 cites·75 claims
- 2692US7268012B2Methods for fabrication of thin semiconductor assemblies including redistribution layers and packages and assemblies formed therebyMICRON TECHNOLOGY INC·Filed 2004·Granted Sep 11, 2007·49 cites·43 claims
- 2791US7060526B2Wafer level methods for fabricating multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 13, 2006·96 cites·38 claims
- 2890US9653420B2Microelectronic devices and methods for filling vias in microelectronic devicesMICRON TECHNOLOGY INC·Filed 2014·Granted May 16, 2017·6 cites·21 claims
- 2990US8268715B2Multi-component integrated circuit contactsHIATT WILLIAM M·Filed 2010·Granted Sep 18, 2012·8 cites·20 claims
- 3088US8404521B2Disabling electrical connections using pass-through 3D interconnects and associated systems and methodsCHAINE MICHAEL·Filed 2012·Granted Mar 26, 2013·7 cites·14 claims
- 3188US8084866B2Microelectronic devices and methods for filling vias in microelectronic devicesHIATT WILLIAM M·Filed 2003·Granted Dec 27, 2011·29 cites·20 claims
- 3288US7589426B2Semiconductor assemblies including redistribution layers and packages and assemblies formed therefromMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 15, 2009·14 cites·21 claims
- 3387US8324100B2Methods of forming conductive viasAKRAM SALMAN·Filed 2011·Granted Dec 4, 2012·7 cites·26 claims
- 3487US7064010B2Methods of coating and singulating wafersMICRON TECHNOLOGY INC·Filed 2003·Granted Jun 20, 2006·33 cites·50 claims
- 3587US6710442B1Microelectronic devices with improved heat dissipation and methods for cooling microelectronic devicesMICRON TECHNOLOGY INC·Filed 2002·Granted Mar 23, 2004·32 cites·58 claims
- 3687US2024339360A1Microfeature workpieces and methods for forming interconnects in microfeature workpiecesMICRON TECHNOLOGY INC·Filed 2024·Application pending·0 cites
- 3786US8669179B2Through-wafer interconnects for photoimager and memory wafersMICRON TECHNOLOGY INC·Filed 2013·Granted Mar 11, 2014·5 cites·13 claims
- 3886US7498258B2Through-hole conductors for semiconductor substrates and method for making sameMICRON TECHNOLOGY INC·Filed 2005·Granted Mar 3, 2009·8 cites·7 claims
- 3986US7115998B2Multi-component integrated circuit contactsMICRON TECHNOLOGY INC·Filed 2002·Granted Oct 3, 2006·27 cites·98 claims
- 4086US6663340B1Wafer carrier transport system for tool baysMOTOROLA INC·Filed 2002·Granted Dec 16, 2003·45 cites·22 claims
- 4185US8772086B2Disabling electrical connections using pass-through 3D interconnects and associated systems and methodsSLIFER RUSSELL D·Filed 2013·Granted Jul 8, 2014·5 cites·17 claims
- 4285US8502353B2Through-wafer interconnects for photoimager and memory wafersAKRAM SALMAN·Filed 2011·Granted Aug 6, 2013·5 cites·11 claims
- 4385US7892972B2Methods for fabricating and filling conductive vias and conductive vias so formedMICRON TECHNOLOGY INC·Filed 2006·Granted Feb 22, 2011·10 cites·30 claims
- 4484US7419841B2Microelectronic imagers and methods of packaging microelectronic imagersMICRON TECHNOLOGY INC·Filed 2006·Granted Sep 2, 2008·10 cites·25 claims
- 4584US7288954B2Compliant contact pin test assembly and methods thereofMICRON TECHNOLOGY INC·Filed 2006·Granted Oct 30, 2007·8 cites·19 claims
- 4684US7282932B2Compliant contact pin assembly, card system and methods thereofMICRON TECHNOLOGY INC·Filed 2004·Granted Oct 16, 2007·16 cites·36 claims
- 4784US7224051B2Semiconductor component having plate and stacked diceMICRON TECHNOLOGY INC·Filed 2006·Granted May 29, 2007·34 cites·20 claims
- 4884US7225044B2Methods for supporting substrates during fabrication of one or more objects thereon by programmable material consolidation techniquesMICRON TECHNOLOGY INC·Filed 2003·Granted May 29, 2007·11 cites·63 claims
- 4984US6998717B2Multi-dice chip scale semiconductor componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Feb 14, 2006·64 cites·39 claims
- 5083US7858429B2Packaged microelectronic imagers and methods of packaging microelectronic imagersROUND ROCK RES LLC·Filed 2007·Granted Dec 28, 2010·8 cites·34 claims
Showing the top 50 of 142 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →