Modular sockets using flexible interconnects

Abstract

A modular bare die socket assembly is provided for attaching a plurality of miniature semiconductor die to a substrate. The socket assembly is comprised of a plurality of two-sided plates joined vertically in a horizontal stack, wherein each plate has a die socket for the removable insertion of a bare semiconductor die. A multi-layer interconnect lead tape has a plurality of lithographically formed leads bent on one end to form nodes for attachment to bond pads on the removably inserted semiconductor die, and having opposing ends connectable to the substrate.

1 . A connector for a semiconductor die having a plurality of bond pads on at least one surface thereof and a substrate comprising: 
 two plates each having a first side, a second side, a first end, and a second end, the first side of a first plate located adjacent the second side of a second plate for forming a die socket having a die slot at a first end thereof and having a lead slot at a second end thereof;    a tape including conductive leads formed on a portion of a film of insulation, at least one of conductive leads having an inner end for resiliently contacting the at least one bond pad of the bare semiconductor die and having an outer end for contacting a substrate;    biasing apparatus for engaging the inner end of the at least one conductive lead into resilient contact with the at least one bond pad of the bare semiconductor die; and    a third plate located adjacent one of the first plate and the second plate for forming a second die socket.    
   
   
       2 . The connector of  claim 1 , wherein the die slot and the lead slot are located in the first plate and the second plate of the two plates when the first plate and the second plate are abutted at the first end and the second end, respectively, of each plate, the lead slot offset from the die slot.  
   
   
       3 . Apparatus for connecting a semiconductor die having a plurality of bond pads on at least one surface thereof and a substrate comprising: 
 two plates each having a first side, a second side, a first end, and a second end, the first side of a first plate located adjacent the second side of a second plate for forming a die socket having a die slot at a first end thereof and a lead slot at a second end thereof;    a tape including conductive leads formed on a portion of an insulation film having at least one conductive lead having an inner end for resiliently contacting at least one bond pad of the bare semiconductor die and having an outer end for contacting a portion of the substrate;    biasing apparatus for engaging the inner end of the at least one conductive lead into resilient contact with the at least one bond pad of the bare semiconductor die; and    a third plate located adjacent one of the first plate and the second plate for forming a second die socket.    
   
   
       4 . The apparatus of  claim 3 , wherein the die slot and the lead slot are located in the first plate and the second plate of the two plates when the first plate and the second plate are abutted at the first end and the second end, respectively, of each plate, the lead slot offset from the die slot.  
   
   
       5 . A vertical connector for connecting a semiconductor die having a plurality of bond pads on at least one surface thereof and a substrate comprising: 
 two plates each having a first side, a second side, a first end, and a second end, the first side of a first plate located adjacent the second side of a second plate for forming a die socket having a die slot at a first end thereof and having a lead slot at a second end thereof;    a tape including at least one lead formed on a portion of a film having an inner end for resilient electrical contact with the plurality of bond pads of one of the bare semiconductor die and an outer end for contacting a substrate;    apparatus for engaging the inner end of the at least one conductive lead into resilient contact with the at least one bond pad of the semiconductor die; and    a third plate located adjacent one of the first plate and the second plate for forming a second die socket.    
   
   
       6 . The vertical connector of  claim 5 , wherein the die slot and the lead slot are located in the first plate and the second plate of the two plates when the first plate and the second plate are abutted at the first end and the second end, respectively, of each plate, the lead slot offset from the die slot.  
   
   
       7 . A method of forming a module for the insertion of semiconductor die thereinto and connecting said semiconductor die to a substrate having conductor thereon, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said method comprising: 
 providing a first plate having first and second major sides with corresponding first and second ends;    providing a second plate having first and second major sides with corresponding first and second ends;    providing a multi-layer interconnect lead tape including a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with bond pads of said semiconductor die and outer ends for electrical contact with said conductors on said substrate;    providing resilient apparatus;    abutting the second major side of said first plate and the first major side of said second plate thereby forming a bare die socket having a die slot at the first ends of said first plate and said second plate and a lead slot at the second ends of said first plate and said second plate, the first ends of said multi-layer interconnect lead tape extending between the second major side of said first plate and the first major side of said second plate and the second ends of said multi-layer interconnect lead tape extending beyond the second ends of said first plate and said second plated.    
   
   
       8 . The method of  claim 7 , further comprising: 
 resiliently biasing the firs ends of said multi-layer interconnect lead tape.    
   
   
       9 . The method of  claim 7 , further comprising: 
 contacting the second ends of said multi-layer interconnect lead tape with the conductors on said substrate.    
   
   
       10 . The method of  claim 7 , further comprising: 
 providing a third plate having a first and second major sides and corresponding first and second ends; and 
 abutting the first major side of said third plate with the second major side of said second plate thereby forming another bare die socket.  
   
   
   
       11 . A method of forming a module for the insertion of semiconductor die thereinto and connecting said semiconductor die to a substrate having conductor thereon, said semiconductor die having a plurality of conductive bond pads on a surface thereof, said method comprising: 
 providing a first plate having first and second major sides with corresponding first and second ends;    providing a second plate having first and second major sides with corresponding first and second ends;    providing a multi-layer interconnect lead tape including a pattern of electrically conductive leads formed on an insulative film, said conductive leads having inner ends for resilient electrical contact with bond pads of said semiconductor die and outer ends for electrical contact with said conductors on said substrate;    providing resilient apparatus;    abutting the second major side of said first plate and the first major side of said second plate thereby forming a bare die socket having a die slot at the first ends of said first plate and said second plate and a lead slot at the second ends of said first plate and said second plate, the first ends of said multi-layer interconnect lead tape extending between the second major side of said first plate and the first major side of said second plate and the second ends of said multi-layer interconnect lead tape extending beyond the second ends of said first plate and said second plated.    
   
   
       12 . The method of  claim 11 , further comprising: 
 resiliently biasing the firs ends of said multi-layer interconnect lead tape.    
   
   
       13 . The method of  claim 11 , further comprising: 
 contacting the second ends of said multi-layer interconnect lead tape with the conductors on said substrate.    
   
   
       14 . The method of  claim 11 , further comprising: 
 providing a third plate having a first and second major sides and corresponding first and second ends; and 
 abutting the first major side of said third plate with the second major side of said second plate thereby forming another bare die socket.  
   
   
   
       15 . A multi-layer interconnect tape for interconnecting the bond pads of a semiconductor die to a substrate, said tape comprising: 
 a first layer of insulative film having first and second surfaces;    a second layer of conductive material formed on a first surface of said insulative film;    
   
   
       16 . The interconnect tape of  claim 15 , wherein said conductive material is metal.  
   
   
       17 . The interconnect tape of  claim 15 , wherein said second layer is formed as a plurality of conductive leads having first ends configured to abut said bond pads of said semiconductor die and second ends for connection to conductive traces of a substrate.  
   
   
       18 . The interconnect tape of  claim 15 , wherein said tape is bent to form nodes in said conductive leads for contact with said bond pads of said semiconductor die.  
   
   
       19 . The interconnect tape of  claim 15 , wherein said tape is abutted against said bond pads of said semiconductor die by a resilient member.  
   
   
       20 . The interconnect tape of  claim 19 , wherein said resilient member comprises an elastomeric member fixed to said first layer.  
   
   
       21 . The interconnect tape of  claim 19 , wherein said resilient member comprises a bendable extension of an apparatus holding said tape.  
   
   
       22 . The interconnect tape of  claim 21 , wherein said resilient member comprises said first layer of said tape.  
   
   
       23 . The interconnect tape of  claim 15 , further comprising a third layer of conductive material formed on said second surface of said first layer and extending past said second layer for contact with additional bond pads of said semiconductor die, said additional bond pads being located in another row of bond pads on said semiconductor die from a first portion of said bond pads of said semiconductor die.  
   
   
       24 . A plate for adapted for abutting an another adjacent plate to form an interconnect socket for a semiconductor die for connection of a substrate, said plate comprising: 
 a generally planar member formed of an insulative material, said plate having a first side and a second side, a first end and a second end;    said second side including a recessed die slot for insertion of a bare die from said first end;    said first side including a recess for holding an interconnect lead tape for resilient contact with said die and a substrate; and    whereby a second side of one said plate abutted to the first side of said another adjacent plate to forms a module for removable insertion of a semiconductor die for electrical interconnection to said substrate.    
   
   
       25 . The plate according to  claim 24 , wherein one side of said recessed die slot comprises of a wall of said second side of said another adjacent plate.  
   
   
       26 . The plate according to  claim 24 , wherein an interconnect lead tape is positioned and retained between a first side of said plate and a second side of a second adjacent plate.  
   
   
       27 . The plate according to  claim 24 , further comprising: 
 alignment posts fixed to said second side for aligning/retaining passage through said interconnect lead tape.    
   
   
       28 . The plate according to  claim 24 , wherein said plate and another adjacent plate are aligned substantially perpendicular to said substrate.