Assignee
WU CHENGWEI
TW·8 granted patents·3 pending applications·23 citations·filing 2015–2022
Top patents by PatentIndex Score
11 records- 0188US9887176B2Semiconductor packageWU CHENGWEI·Filed 2017·Granted Feb 6, 2018·13 cites·20 claims
- 0282US10541217B2Semiconductor packageWU CHENGWEI·Filed 2018·Granted Jan 21, 2020·3 cites·18 claims
- 0381US11658137B2Semiconductor packageWU CHENGWEI·Filed 2021·Granted May 23, 2023·1 cites·18 claims
- 0479US10957662B2Semiconductor packageWU CHENGWEI·Filed 2019·Granted Mar 23, 2021·2 cites·18 claims
- 0579US9679872B1Connection structure for semiconductor package having plural vias located within projection of conductive unitWU CHENGWEI·Filed 2016·Granted Jun 13, 2017·4 cites·18 claims
- 0674US2023106826A1Semiconductor PackageWU CHENGWEI·Filed 2022·Application pending·0 cites
- 0761US2020212007A1Semiconductor PackageWU CHENGWEI·Filed 2020·Application pending·0 cites
- 0856US10600757B2Semiconductor packageWU CHENGWEI·Filed 2019·Granted Mar 24, 2020·0 cites·20 claims
- 0954US10283467B2Semiconductor packageWU CHENGWEI·Filed 2017·Granted May 7, 2019·0 cites·17 claims
- 1051US10269765B2Semiconductor packageWU CHENGWEI·Filed 2017·Granted Apr 23, 2019·0 cites·20 claims
- 1146US2016155723A1Semiconductor packageWU CHENGWEI·Filed 2015·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →