Assignee
WUHAN XINXIN SEMICONDUCTOR MFG
CN·86 granted patents·67 pending applications·40 citations·filing 2015–2025
Top patents by PatentIndex Score
153 records- 0189US11791367B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Oct 17, 2023·2 cites·6 claims
- 0288US10498215B1Voltage regulator with flexible output voltageWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Dec 3, 2019·5 cites·10 claims
- 0384US11844210B2Storage device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Dec 12, 2023·2 cites·20 claims
- 0484US10943853B2Semiconductor device and manufacturing method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Mar 9, 2021·4 cites·20 claims
- 0583US11804458B2Method of fabricating integrated circuit deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Oct 31, 2023·1 cites·18 claims
- 0681US10606299B2Circuit for regulating leakage current in charge pumpWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Mar 31, 2020·3 cites·19 claims
- 0777US11114414B2Wafer structure with capacitive chip interconnection, method for manufacturing the same, and chip structure with capacitive chip interconnectionWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Sep 7, 2021·2 cites·14 claims
- 0877US11107794B2Multi-wafer stack structure and forming method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 31, 2021·3 cites·7 claims
- 0977US2026044086A1Mask, mask stitching method and exposure methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 1077US2023378232A1Semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 1177US2023378233A1Method of fabricating semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 1275US10452087B2Low drop-out regulatorWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Oct 22, 2019·2 cites·15 claims
- 1374US10930619B2Multi-wafer bonding structure and bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Feb 23, 2021·3 cites·20 claims
- 1473US10739801B2Band-gap reference circuitWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Aug 11, 2020·2 cites·10 claims
- 1572US10783969B2Sense amplifierWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Sep 22, 2020·4 cites·9 claims
- 1670US11069647B2Semiconductor wafer, bonding structure and wafer bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Jul 20, 2021·2 cites·17 claims
- 1769US12386701B2Memory chips and operating methods thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 1868US10566203B1Method for alleviating etching defect of salicide barrier layerWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Feb 18, 2020·1 cites·11 claims
- 1967US12386698B2Memory chips and operating methods thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Granted Aug 12, 2025·0 cites·20 claims
- 2067US2026018197A1Sense amplifier, voltage control method, and memoryWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 2167US2026032928A1Semiconductor device and method for fabricating sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 2267US2026033303A1Wafer stacking method and wafer stack structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 2366US12243905B2Method of forming metal grid, backside-illuminated image sensor and method of forming the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Mar 4, 2025·0 cites·14 claims
- 2466US10340793B1Digital control of charge pumpWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Jul 2, 2019·1 cites·9 claims
- 2565US10784355B2Gate hole defect relieving methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2018·Granted Sep 22, 2020·1 cites·7 claims
- 2664US11081462B2Method for manufacturing a bonding structureWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 3, 2021·1 cites·6 claims
- 2764US2025151422A1Backside-illuminated image sensorWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 2863US11107726B2Method for manufacturing bonding pad in semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 31, 2021·1 cites·6 claims
- 2961US2026018558A1Bonding apparatus and bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 3061US2026018448A1Bonding apparatus and bonding methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 3161US2026006864A1Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 3259US2025174495A1Semiconductor structure with buried power rails and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 3358US11869935B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Jan 9, 2024·0 cites·18 claims
- 3458US2026084237A1Laser cutting apparatus and wafer cutting methodWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
- 3557US12575383B2Manufacturing method for semiconductor device and semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Granted Mar 10, 2026·0 cites·20 claims
- 3657US2025383479A1Optical device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 3757US2024332079A1Dicing method, bonding method and dieWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 3857US2025254879A1Memory block, memory device, and memory cellWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2025·Application pending·0 cites
- 3956US12408400B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Sep 2, 2025·0 cites·16 claims
- 4056US12354660B2Semiconductor devicesWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 4156US12094704B2Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Sep 17, 2024·0 cites·9 claims
- 4256US11107856B2Manufacturing method of image sensing deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2019·Granted Aug 31, 2021·0 cites·11 claims
- 4356US10867969B2Multi-wafer stacking structure and fabrication method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2020·Granted Dec 15, 2020·0 cites·12 claims
- 4456US2025149091A1Semiconductor devices and operation methods thereof, and memory systemsWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2024·Application pending·0 cites
- 4555US12328963B2Semiconductor device and manufacturing method thereforWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Granted Jun 10, 2025·0 cites·18 claims
- 4655US2024414914A1Memory block and manufacture method thereofWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 4755US2025166714A1Semiconductor device, operation method thereof, and storage systemWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2024·Application pending·0 cites
- 4855US2025069966A1C2w structure and method for making sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2023·Application pending·0 cites
- 4954US11906577B2Pad structure and testkey structure and testing method for semiconductor deviceWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2021·Granted Feb 20, 2024·0 cites·20 claims
- 5054US2023253439A1Semiconductor device and method of fabricating the sameWUHAN XINXIN SEMICONDUCTOR MFG·Filed 2022·Application pending·0 cites
Showing the top 50 of 153 patent records by PatentIndex Score.
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