Assignee
YANG DEOKKYUNG
KR·5 granted patents·29 citations·filing 2009–2011
Top patents by PatentIndex Score
5 records- 0187US8067306B2Integrated circuit packaging system with exposed conductor and method of manufacture thereofYANG DEOKKYUNG·Filed 2010·Granted Nov 29, 2011·11 cites·20 claims
- 0281US8633100B2Method of manufacturing integrated circuit packaging system with support structureYANG DEOKKYUNG·Filed 2011·Granted Jan 21, 2014·6 cites·18 claims
- 0379US8518752B2Integrated circuit packaging system with stackable package and method of manufacture thereofYANG DEOKKYUNG·Filed 2009·Granted Aug 27, 2013·8 cites·20 claims
- 0471US9748203B2Integrated circuit packaging system with conductive pillars and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Aug 29, 2017·3 cites·10 claims
- 0562US8603859B2Integrated circuit packaging system with dual side mold and method of manufacture thereofYANG DEOKKYUNG·Filed 2011·Granted Dec 10, 2013·1 cites·20 claims
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