Assignee
YEE KUO-CHUNG
TW·3 granted patents·1 pending application·80 citations·filing 2010–2012
Top patents by PatentIndex Score
4 records- 0197US9136293B2Methods and apparatus for sensor moduleYEE KUO-CHUNG·Filed 2012·Granted Sep 15, 2015·45 cites·20 claims
- 0296US8252629B2Method for making a stackable packageYEE KUO-CHUNG·Filed 2010·Granted Aug 28, 2012·30 cites·20 claims
- 0382US8741691B2Method of fabricating three dimensional integrated circuitYEE KUO-CHUNG·Filed 2012·Granted Jun 3, 2014·5 cites·14 claims
- 0448US2013020703A1Method for Making a Stackable PackageYEE KUO-CHUNG·Filed 2012·Application pending·0 cites
Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →