Assignee
YOON HYUNGSUK ALEXANDER
US·9 granted patents·5 pending applications·50 citations·filing 2006–2012
Top patents by PatentIndex Score
14 records- 0190US8883027B2Methods for removing a metal oxide from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Nov 11, 2014·10 cites·30 claims
- 0290US8287647B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Oct 16, 2012·12 cites·7 claims
- 0386US8916232B2Method for barrier interface preparation of copper interconnectYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Dec 23, 2014·9 cites·30 claims
- 0482US8127395B2Apparatus for isolated bevel edge clean and method for using the sameYOON HYUNGSUK ALEXANDER·Filed 2006·Granted Mar 6, 2012·8 cites·14 claims
- 0579US8926789B2Apparatus for the removal of a fluorinated polymer from a substrateYOON HYUNGSUK ALEXANDER·Filed 2010·Granted Jan 6, 2015·4 cites·19 claims
- 0676US8298433B2Methods for removing an edge polymer from a substrateYOON HYUNGSUK ALEXANDER·Filed 2009·Granted Oct 30, 2012·4 cites·18 claims
- 0774US8623456B2Methods for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2012·Granted Jan 7, 2014·2 cites·11 claims
- 0856US2009320749A1Apparatus for integrated surface treatment and deposition for copper interconnectYOON HYUNGSUK ALEXANDER·Filed 2009·Application pending·0 cites
- 0955US8058164B2Methods of fabricating electronic devices using direct copper platingYOON HYUNGSUK ALEXANDER·Filed 2007·Granted Nov 15, 2011·1 cites·17 claims
- 1054US9359673B2Apparatus and method for atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2012·Granted Jun 7, 2016·0 cites·18 claims
- 1154US2008260967A1Apparatus and method for integrated surface treatment and film depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Application pending·0 cites
- 1246US2012118320A1Methods for Isolated Bevel Edge CleanYOON HYUNGSUK ALEXANDER·Filed 2012·Application pending·0 cites
- 1345US2008260963A1Apparatus and method for pre and post treatment of atomic layer depositionYOON HYUNGSUK ALEXANDER·Filed 2007·Application pending·0 cites
- 1439US2012056325A1Methods of fabricating electronic devices using direct copper platingYOON HYUNGSUK ALEXANDER·Filed 2011·Application pending·0 cites
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Counts cover granted patents and pending applications in the PatentIndex corpus. How scoring works →