Assignee
YOUSIF IMAD
US·2 granted patents·1 pending application·24 citations·filing 2007–2012
Top patents by PatentIndex Score
3 records- 0186US8329593B2Method and apparatus for removing polymer from the wafer backside and edgeYOUSIF IMAD·Filed 2007·Granted Dec 11, 2012·14 cites·17 claims
- 0257USD699692SUpper linerYOUSIF IMAD·Filed 2012·Granted Feb 18, 2014·10 cites·1 claims
- 0346US2013334199A1Thin heated substrate supportYOUSIF IMAD·Filed 2012·Application pending·0 cites
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