Thin heated substrate support

Abstract

Embodiments of the present invention provide an apparatus heating and supporting a substrate in a processing chamber. One embodiment of the present invention provides a substrate support assembly. The substrate support assembly includes a heated plate having a substrate supporting surface on a front side and a cantilever arm extending from a backside of the heated plate. The heated plate is configured to support and heat a substrate on the substrate supporting surface. The cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.

1 . A substrate support assembly, comprising:
 a heated plate having a front side and a backside, the front side including a substrate supporting surface;   a heating element disposed in the heated plate; and   a cantilever arm extending from the backside of the heated plate, wherein the cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis.   
     
     
         2 . The substrate support assembly of  claim 1  further comprising:
 a thermal isolator coupled to the backside of the heated plate at the central axis of the heated plate, wherein thermal isolator extends through an opening in the cantilever arm. 
 
     
     
         3 . The substrate support assembly of  claim 1 , further comprising a bi-metal joint configured to thermally isolate the heated plate, wherein the bi-metal joint comprises a first portion formed from a first metal and a second portion formed from the second metal dissimilar to the first metal. 
     
     
         4 . The substrate support assembly of  claim 3 , further comprising an extension tube attached to the cantilever arm near the second end, wherein the bi-metal joint connects between the cantilever arm and the extension tube, the heated plate and the cantilever arm are formed from the first metal and the extension tube is formed from a second metal dissimilar to the first metal. 
     
     
         5 . The substrate support assembly of  claim 4 , wherein the first metal is aluminum and the second metal is stainless steel. 
     
     
         6 . The substrate support assembly of  claim 4 , wherein the extension tube comprises a bellows. 
     
     
         7 . The substrate support assembly of  claim 3 , wherein the heated plate comprises:
 an upper heated plate forming the substrate supporting surface;   a lower heated pate attached to the upper heated plate, wherein the heating element is sandwiched between the upper heated plate and the lower heated plate; and   a heating lead attached to the heating element, the heating lead is disposed in a passage formed in the cantilever arm.   
     
     
         8 . The substrate support assembly of  claim 3 , further comprising a pumping pipe fluidly connected to chucking channels formed on the substrate supporting surface, wherein the pumping pipe is disposed in a passage formed in the cantilever arm. 
     
     
         9 . The substrate support assembly of  claim 8 , wherein the pumping pipe comprises:
 a horizontal tube disposed within a recess formed in the cantilever arm; and   a vacuum joint bonding the horizontal tube to the backside of the heated plate, wherein the heated plate and the horizontal tube are formed from dissimilar metals, and the vacuum joint comprises a first portion and a second portion formed from the two dissimilar metals.   
     
     
         10 . The substrate support assembly of  claim 3 , further comprising:
 one or more sensors disposed in the heated plate; and   a sensing lead connecting the one or more sensors, wherein the sensing lead is disposed in a passage formed in the cantilever arm.   
     
     
         11 . The substrate support assembly of  claim 4 , further comprising:
 a second bi-metal joint; and   a bellows coupled to the extension tube by the second bi-metal joint.   
     
     
         12 . The substrate support assembly of  claim 3 , further comprising:
 a pumping pipe coupled the heated plate by the bi-metal joint.   
     
     
         13 . The substrate support assembly of  claim 3 , wherein the first portion and second portion of the bi-metal joint are coupled together by explosion bonded. 
     
     
         14 . A method for processing a substrate, comprising:
 placing the substrate a substrate supporting surface of a substrate support assembly, wherein the substrate support assembly is supported by a thermal insert disposed in a processing chamber so that the substrate support assembly does not directly contact a chamber body, and the substrate support assembly comprises:   a heated plate having a front side and a backside, the front side including the substrate supporting surface;   a heating element disposed in the heated plate; and   a cantilever arm extending from the backside of the heated plate, wherein the cantilever arm has a first end attached to the heated plate near a central axis of the heated plate, and a second end extending radially outwards from the central axis; and   heating the substrate using the heated plate of the substrate support assembly.   
     
     
         15 . The method of  claim 14 , further comprising cooling the chamber body by supplying a cooling fluid to a cooling adaptor connected to the substrate support assembly and the chamber body. 
     
     
         16 . The method of  claim 14 , further comprising coupling a thermal isolator to the backside of the heated plate at the central axis of the heated plate, wherein thermal isolator extends through an opening in the cantilever arm. 
     
     
         17 . The method of  claim 14 , further comprising thermally isolating the heated plate using a bi-metal joint, wherein the bi-metal joint comprises a first portion formed from a first metal and s second portion formed from the second metal dissimilar to the first metal. 
     
     
         18 . The method of  claim 17 , further comprising attaching an extension tube to the cantilever arm near the second end, wherein the bi-metal joint connects between the cantilever arm and the extension tube, the heated plate and the cantilever arm are formed from the first metal and the extension tube is formed from a second metal dissimilar to the first metal. 
     
     
         19 . The method of  claim 17 , further comprising coupling the first portion and second portion of the bi-metal joint together by explosion bond. 
     
     
         20 . The method of  claim 17 , further comprising attaching a heating lead to the heating element, wherein the heating lead is disposed in a passage formed in the cantilever arm.