Inventor · disambiguated record
Jared Ahmad Lee
Also filed as: LEE JARED AHMAD
37 granted patents·13 pending applications·160 citations·filing 2007–2025
96Inventor score
Top patents by PatentIndex Score
50 records- 0197US9976211B2Plasma erosion resistant thin film coating for high temperature applicationAPPLIED MATERIALS INC·Filed 2015·Granted May 22, 2018·10 cites·13 claims
- 0295US11584993B2Thermally uniform deposition stationAPPLIED MATERIALS INC·Filed 2020·Granted Feb 21, 2023·4 cites·18 claims
- 0395US7846497B2Method and apparatus for controlling gas flow to a processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Dec 7, 2010·37 cites·21 claims
- 0494US11110425B2Gas distribution plate for thermal depositionAPPLIED MATERIALS INC·Filed 2019·Granted Sep 7, 2021·4 cites·20 claims
- 0594US10204805B2Thin heated substrate supportAPPLIED MATERIALS INC·Filed 2016·Granted Feb 12, 2019·10 cites·19 claims
- 0693US7775236B2Method and apparatus for controlling gas flow to a processing chamberAPPLIED MATERIALS INC·Filed 2007·Granted Aug 17, 2010·25 cites·20 claims
- 0791US11583816B2Gas distribution plate for thermal depositionAPPLIED MATERIALS INC·Filed 2021·Granted Feb 21, 2023·1 cites·18 claims
- 0891US10815562B2Plasma erosion resistant thin film coating for high temperature applicationAPPLIED MATERIALS INC·Filed 2018·Granted Oct 27, 2020·4 cites·20 claims
- 0990US11776793B2Plasma source with ceramic electrode plateAPPLIED MATERIALS INC·Filed 2020·Granted Oct 3, 2023·2 cites·20 claims
- 1090US11705312B2Vertically adjustable plasma sourceAPPLIED MATERIALS INC·Filed 2020·Granted Jul 18, 2023·2 cites·13 claims
- 1190US8845816B2Method extending the service interval of a gas distribution plateDIAZ ADAUTO·Filed 2012·Granted Sep 30, 2014·8 cites·11 claims
- 1290US7975558B2Method and apparatus for gas flow measurementAPPLIED MATERIALS INC·Filed 2010·Granted Jul 12, 2011·9 cites·22 claims
- 1389US10090181B2Method and apparatus for substrate transfer and radical confinementLEE JARED AHMAD·Filed 2012·Granted Oct 2, 2018·9 cites·15 claims
- 1487US8074677B2Method and apparatus for controlling gas flow to a processing chamberGOLD EZRA ROBERT·Filed 2007·Granted Dec 13, 2011·19 cites·20 claims
- 1584US10566205B2Abatement and strip process chamber in a load lock configurationAPPLIED MATERIALS INC·Filed 2013·Granted Feb 18, 2020·4 cites·20 claims
- 1684US8992689B2Method for removing halogen-containing residues from substrateDIAZ ADAUTO·Filed 2012·Granted Mar 31, 2015·8 cites·6 claims
- 1781US12288677B2Vertically adjustable plasma sourceAPPLIED MATERIALS INC·Filed 2023·Granted Apr 29, 2025·0 cites·20 claims
- 1881US12094715B2Abatement and strip process chamber in a load lock configurationAPPLIED MATERIALS INC·Filed 2023·Granted Sep 17, 2024·0 cites·17 claims
- 1979US2025232964A1Vertically adjustable plasma sourceAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 2077US11773479B2Plasma erosion resistant thin film coating for high temperature applicationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 3, 2023·0 cites·15 claims
- 2174US11043386B2Enhanced spatial ALD of metals through controlled precursor mixingAPPLIED MATERIALS INC·Filed 2018·Granted Jun 22, 2021·1 cites·19 claims
- 2272US11574831B2Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2020·Granted Feb 7, 2023·0 cites·18 claims
- 2372US11171008B2Abatement and strip process chamber in a dual load lock configurationAPPLIED MATERIALS INC·Filed 2019·Granted Nov 9, 2021·1 cites·20 claims
- 2470US11887856B2Enhanced spatial ALD of metals through controlled precursor mixingAPPLIED MATERIALS INC·Filed 2021·Granted Jan 30, 2024·0 cites·17 claims
- 2569US10276354B2Segmented focus ring assemblyAPPLIED MATERIALS INC·Filed 2013·Granted Apr 30, 2019·1 cites·7 claims
- 2666US10943788B2Abatement and strip process chamber in a load lock configurationAPPLIED MATERIALS INC·Filed 2019·Granted Mar 9, 2021·0 cites·19 claims
- 2765US2020144067A1Abatement and strip process chamber in a load lock configurationAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2864US2020066563A1Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2019·Application pending·0 cites
- 2962US11479855B2Spatial wafer processing with improved temperature uniformityAPPLIED MATERIALS INC·Filed 2020·Granted Oct 25, 2022·0 cites·10 claims
- 3062US10468282B2Method and apparatus for substrate transfer and radical confinementAPPLIED MATERIALS INC·Filed 2018·Granted Nov 5, 2019·0 cites·14 claims
- 3162US9464732B2Apparatus for uniform pumping within a substrate process chamberAPPLIED MATERIALS INC·Filed 2013·Granted Oct 11, 2016·1 cites·20 claims
- 3261US10787739B2Spatial wafer processing with improved temperature uniformityAPPLIED MATERIALS INC·Filed 2019·Granted Sep 29, 2020·0 cites·16 claims
- 3358US11177136B2Abatement and strip process chamber in a dual loadlock configurationAPPLIED MATERIALS INC·Filed 2019·Granted Nov 16, 2021·0 cites·17 claims
- 3455US9587789B2Methods and apparatus for providing a gas mixture to a pair of process chambersAPPLIED MATERIALS INC·Filed 2013·Granted Mar 7, 2017·0 cites·18 claims
- 3554US2025014938A1Edge rings for improved edged uniformity in semiconductor processing operationsLAM RES CORP·Filed 2022·Application pending·0 cites
- 3649US9885567B2Substrate placement detection in semiconductor equipment using thermal response characteristicsAPPLIED MATERIALS INC·Filed 2014·Granted Feb 6, 2018·0 cites·19 claims
- 3749US2017306490A1Enhanced Spatial ALD Of Metals Through Controlled Precursor MixingAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3847US10453694B2Abatement and strip process chamber in a dual loadlock configurationLEE JARED AHMAD·Filed 2012·Granted Oct 22, 2019·0 cites·20 claims
- 3947US10010912B2Particle reduction via throttle gate valve purgeAPPLIED MATERIALS INC·Filed 2014·Granted Jul 3, 2018·0 cites·20 claims
- 4047US8616224B2Methods and apparatus for providing a gas mixture to a pair of process chambersLEE JARED AHMAD·Filed 2010·Granted Dec 31, 2013·0 cites·9 claims
- 4147US2011265951A1Twin chamber processing systemAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 4246US2009272717A1Method and apparatus of a substrate etching system and processAPPLIED MATERIALS INC·Filed 2009·Application pending·0 cites
- 4346US2013334199A1Thin heated substrate supportYOUSIF IMAD·Filed 2012·Application pending·0 cites
- 4441US8562742B2Apparatus for radial delivery of gas to a chamber and methods of use thereofLEE JARED AHMAD·Filed 2010·Granted Oct 22, 2013·0 cites·20 claims
- 4539US8616043B2Methods and apparatus for calibrating pressure gauges in a substrate processing systemCRUSE JAMES P·Filed 2010·Granted Dec 31, 2013·0 cites·18 claims
- 4639US2012222813A1Vacuum chambers with shared pumpPAL ANIRUDDHA·Filed 2012·Application pending·0 cites
- 4739US2013059403A1Method and apparatus for wafer temperature measurement using an independent light sourceLEE JARED AHMAD·Filed 2012·Application pending·0 cites
- 4838US2011265883A1Methods and apparatus for reducing flow splitting errors using orifice ratio conductance controlAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 4937US2011269314A1Process chambers having shared resources and methods of use thereofAPPLIED MATERIALS INC·Filed 2010·Application pending·0 cites
- 5034US2011304078A1Methods for removing byproducts from load lock chambersLEE JARED AHMAD·Filed 2011·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Jared Ahmad Lee files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →