Inventor

LAN JE-HSIUNG

US62 patents

⚠️ This page may combine multiple inventors who share the name “LAN JE-HSIUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAN JE-HSIUNG

QUALCOMM INC

Varying thickness inductor

Capacitor interposer layer (CIL) in a die-to-wafer three-dimensional (3D) integrated circuit (IC) (3DIC)

Vertical-coupling transformer with an air-gap structure

Hybrid transformer structure on semiconductor devices

High pass filters and low pass filters using through glass via technology

MEMS varactors

Diplexer design using through glass via technology

Surface acoustic wave (SAW) filter packages employing an enhanced thermally conductive cavity frame for heat dissipation, and related fabrication methods

Stacked circuits of III-V devices over silicon with high quality integrated passives with hybrid bonding

Device with 3D inductor and magnetic core in substrate

Stress compensation patterning

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

Tunable diplexers in three-dimensional (3D) integrated circuits (IC) (3DIC) and related components and methods

RF multiplexer with integrated directional couplers

Substrate comprising acoustic resonators configured as at least one acoustic filter

Backend and acoustic process integration for high-Q filter

Integrated device and integrated passive device comprising magnetic material

Method and apparatus for light induced etching of glass substrates in the fabrication of electronic circuits

Antenna module as a radio-frequency (RF) integrated circuit (IC) die with an integrated antenna substrate, and related fabrication methods

3D inductor design using bundle substrate vias

Thermal bridge interposer structure

Thin film resistor (TFR) device structure for high performance radio frequency (RF) filter design

Device on ceramic substrate

Capacitor interposer layer (CIL) chiplet design with conformal die edge pattern around bumps

Stacked inductor having a discrete metal-stack pattern

Antenna on glass with air cavity structure

Heterogeneous integrated wideband high electron mobility transistor power amplifier with a single-crystal acoustic resonator/filter

Advanced integrated passive device (IPD) with thin-film heat spreader (TF-HS) layer for high power handling filters in transmit (TX) path

Resonator device

Metamorphic high electron mobility transistor-heterojunction bipolar transistor integration

Die-to-wafer hybrid bonding with forming glass

Inductive device structure and process method

MEMS varactors

Integrated device and integrated passive device comprising magnetic material

Through molding contact enabled EMI shielding

Capacitor embedded 3D resonator for broadband filter

Antenna modules employing three-dimensional (3D) build-up on mold package to support efficient integration of radio-frequency (RF) circuitry, and related fabrication methods

ESL-less AC resistor for high frequency applications

Radio frequency front end (RFFE) hetero-integration

Package comprising stacked filters with a shared substrate cap

Integrated device with electromagnetic shield

QUALCOMM MEMS TECHNOLOGIES INC

High aperture-ratio top-reflective AM-iMod displays

Apparatus and method of dual-mode display

Encapsulation methods for interferometric modulator and MEMS devices

Apparatus and method of dual-mode display

LAN JE-HSIUNG

High density metal-insulator-metal trench capacitor

Two-terminal variable capacitance MEMS device

KIM JONGHAE

Electromechanical systems oscillator with piezoelectric contour mode resonator for multiple frequency generation

Three dimensional inductor and transformer design methodology of glass technology

DUPONT DISPLAYS INC

Circuits including switches for electronic devices and methods of using the electronic devices