Inventor

IMORI TORU

JP43 patents

⚠️ This page may combine multiple inventors who share the name “IMORI TORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IMORI TORU

NIPPON MINING CO

Metal powder for powder metallurgy and iron-based sintered compact

Iron-based sintered compact and method for production thereof

Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless plating

Process for producing high-purity organic phosphine

Iron-based sintered compact and method for production thereof

Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate material

Method of surface treatment using imidazole compound

Metal plating method and pretreatment agent

Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body

Metallic powder for powder metallurgy whose main component is iron and iron-based sintered body

Electronic component formed with barrier-seed layer on base material

JX NIPPON MINING & METALS CORP

High purity tin and method for manufacturing same

Oxidation-resistant metallic tin

Method for manufacturing high purity tin, electrowinning apparatus for high purity tin and high purity tin

High purity tin and method for manufacturing same

High purity tin and method for producing same

Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing same

Method for vacuum packing high-purity tin and vacuum-packed high purity tin

ITO JUNICHI

Substrate and manufacturing method therefor

Substrate comprising alloy film of metal element having barrier function and metal element having catalytic power

Plated product having copper thin film formed thereon by electroless plating

Substrate and manufacturing method therefor

NIKKO MATERIALS CO LTD

Plating pretreatment agent and metal plating method using the same

Electroless plating method and semiconductor wafer on which metal plating layer is formed

Adhesion accelerator for bonding rubber to metal and rubber composition

IMORI TORU

Method for electroless plating and metal-plated article

Method for supporting metal nanoparticles and metal nanoparticles-carrying substrate

Electroless plating pretreatment agent, electroless plating method using same, and electroless plated object

SEKIGUCHI JUNNOSUKE

Electronic component formed with barrier-seed layer on base material

ULSI micro-interconnect member having ruthenium electroplating layer on barrier layer

High-purity aqueous copper sulfonate solution and method of producing same

YABE ATSUSHI

Electroless copper plating solution

Plated article having metal thin film formed by electroless plating

Plated article having metal thin film formed by electroless plating, and manufacturing method thereof

JAPAN ENERGY CORP

Lubricating oil for internal combustion engine comprising oxymolybdenum dithiocarbamate sulfide

Molybdenum soap-containing metallic soap and method for producing the same

JX ADVANCED METALS CORP

Stannous oxide powder and method for producing same

Copper electrode material

NIKKON MATERIALS CO LTD

Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using these

UNIV CALIFORNIA

High molecular weight polystannanes by metal-catalyzed dehydropolymerization

BRIDGESTONE CORP

Adhesion promoter composition and adherent rubber composition containing the same

JX METALS CORP

Stannous oxide powder

KIKUCHI JUN-ICHI

Metal-coated lipid bilayer vesicles and process for producing same