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US9823362B2ActiveUtilityPatentIndex 50

Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing same

Assignee: JX NIPPON MINING & METALS CORPPriority: Jul 3, 2014Filed: Dec 27, 2016Granted: Nov 21, 2017
Est. expiryJul 3, 2034(~8 yrs left)· nominal 20-yr term from priority
Inventors:MURAKAMI MASAOMIMIKAMI MAKOTOMURAKAMI KOUJINODA AKIRAIMORI TORU
H10W 72/01938H10W 72/01935H10W 72/952H10W 72/923H10W 72/90G01T 1/24H01L 2224/05584H01L 2224/03464H01L 31/0296H01L 2224/0345H01L 2224/05664H01L 2224/05655H01L 31/02005H01L 24/09H01L 27/146H01L 27/144H01L 2224/0558H01L 2224/05583H01L 2224/05644H01L 24/06H01L 31/115H01L 31/08H01L 31/02966H01L 24/05H01L 31/022408H10F 77/1237H10F 77/123H10F 77/933H10F 77/206H10F 39/12H10F 39/10H10F 30/29H10F 30/00H10F 39/811H10F 39/022H10F 39/195H10F 39/809
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Claims

Abstract

The present invention provides a radiation detector UBM electrode structure body and a radiation detector which suppress the degradation of metal electrode layers at the time of formation of UBM layers and achieve sufficient electric characteristics, and a method of manufacturing the same. A radiation detector UBM electrode structure body according to the present invention includes a substrate made of CdTe or CdZnTe, comprising a Pt or Au electrode layer formed on the substrate by electroless plating, an Ni layer formed on the Pt or Au electrode layer by sputtering, and an Au layer formed on the Ni layer by sputtering.

Claims

exact text as granted — not AI-modified
The invention claimed is: 
     
       1. A radiation detector UBM electrode structure body including a substrate made of CdTe or CdZnTe, comprising:
 a Pt or Au electrode layer formed on the substrate by electroless plating; 
 a Ni layer formed on the Pt or Au electrode layer by sputtering, a thickness of the Ni layer being 0.2 μm or more and 0.6 μm or less; and 
 a Pd layer and an Au layer sequentially formed on the Ni layer by sputtering, a thickness of the Pd layer being 0.03 μm or more and 0.1 μm or less. 
 
     
     
       2. The radiation detector UBM electrode structure body according to  claim 1 , further comprising an insulating film arranged on side surfaces of the Pt or Au electrode layer and an UBM layer including the Ni layer, the Pd layer, and the Au layer, part of an upper surface of the UBM layer, and a surface of the substrate on which the Pt or Au electrode layer is arranged. 
     
     
       3. A radiation detector comprising:
 a radiation detection element including the radiation detector UBM electrode structure body according to  claim 1  and a metal electrode layer disposed on the substrate so as to face the Pt or Au electrode layer formed by electroless plating; and 
 a detection circuit connected to the Au layer of the radiation detection element via a bump. 
 
     
     
       4. A method of manufacturing a radiation detector, comprising:
 forming a radiation detection element by cutting the radiation detector UBM electrode structure body according to  claim 1 ; and 
 connecting a detection circuit to the Au layer of the radiation detection element via a bump. 
 
     
     
       5. A method of manufacturing a radiation detector UBM electrode structure body, comprising:
 preparing a substrate made of CdTe or CdZnTe; 
 forming a metal electrode on a first surface of the substrate and forming a Pt or Au electrode layer on a second surface of the substrate by electroless plating so as to face the metal electrode; 
 forming a Ni layer having a thickness of 0.2 μm or more and 0.6 μm or less on the Pt or Au electrode layer by sputtering; 
 forming a Pd layer having a thickness of 0.03 μm or more and 0.1 μm or less on the Ni layer by sputtering; and 
 forming an Au layer on the Pd layer by sputtering. 
 
     
     
       6. The method of manufacturing the radiation detector UBM electrode structure body according to  claim 5 , further comprising forming an insulating film arranged on side surfaces of the Pt or Au electrode layer and a UBM layer including the Ni layer, the Pd layer, and the Au layer, part of an upper surface of the UBM layer, and a surface of the substrate on which the Pt or Au electrode layer is arranged.

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