Inventor · disambiguated record
Toru Imori
Also filed as: IMORI TORU
43 granted patents·10 pending applications·170 citations·filing 1992–2020
97Inventor score
Top patents by PatentIndex Score
53 records- 0189US10400342B2High purity tin and method for manufacturing sameJX NIPPON MINING & METALS CORP·Filed 2016·Granted Sep 3, 2019·2 cites·8 claims
- 0284US6780467B2Plating pretreatment agent and metal plating method using the sameNIKKO MATERIALS CO LTD·Filed 2001·Granted Aug 24, 2004·24 cites·14 claims
- 0382US11981581B2Stannous oxide powderJX METALS CORP·Filed 2018·Granted May 14, 2024·1 cites·7 claims
- 0480US7968150B2Method of surface treatment using imidazole compoundNIPPON MINING CO·Filed 2008·Granted Jun 28, 2011·2 cites·2 claims
- 0580US7217310B2Metal powder for powder metallurgy and iron-based sintered compactNIPPON MINING CO·Filed 2003·Granted May 15, 2007·24 cites·3 claims
- 0679US7666245B2Metallic powder for powder metallurgy whose main component is iron and iron-based sintered bodyNIPPON MINING CO·Filed 2005·Granted Feb 23, 2010·3 cites·6 claims
- 0778US7045461B2Metal plating method, pretreatment agent, and semiconductor wafer and semiconductor device obtained using theseNIKKON MATERIALS CO LTD·Filed 2004·Granted May 16, 2006·20 cites·11 claims
- 0877US7727639B2Iron-based sintered compact and method for production thereofNIPPON MINING CO·Filed 2008·Granted Jun 1, 2010·3 cites·3 claims
- 0976US7347969B2Iron-based sintered compact and method for production thereofNIPPON MINING CO·Filed 2003·Granted Mar 25, 2008·13 cites·8 claims
- 1073US7713340B2Pretreating agent for electroless plating, method of electroless plating using the same and product of electroless platingNIPPON MINING CO·Filed 2004·Granted May 11, 2010·11 cites·12 claims
- 1172US7691172B2Metallic powder for powder metallurgy whose main component is iron and iron-based sintered bodyNIPPON MINING CO·Filed 2005·Granted Apr 6, 2010·3 cites·13 claims
- 1269US11572632B2Method for manufacturing high purity tin, electrowinning apparatus for high purity tin and high purity tinJX NIPPON MINING & METALS CORP·Filed 2019·Granted Feb 7, 2023·0 cites·10 claims
- 1369US7179741B2Electroless plating method and semiconductor wafer on which metal plating layer is formedNIKKO MATERIALS CO LTD·Filed 2003·Granted Feb 20, 2007·9 cites·16 claims
- 1468US5916851ALubricating oil for internal combustion engine comprising oxymolybdenum dithiocarbamate sulfideJAPAN ENERGY CORP·Filed 1996·Granted Jun 29, 1999·23 cites·17 claims
- 1564US12132289B2Copper electrode materialJX ADVANCED METALS CORP·Filed 2020·Granted Oct 29, 2024·0 cites·5 claims
- 1664US11136680B2High purity tin and method for manufacturing sameJX NIPPON MINING & METALS CORP·Filed 2019·Granted Oct 5, 2021·0 cites·5 claims
- 1764US8043705B2Resin substrate material, electronic component substrate material manufactured by electroless plating on the same, and method for manufacturing electronic component substrate materialNIPPON MINING CO·Filed 2006·Granted Oct 25, 2011·2 cites·11 claims
- 1862US12297121B2Stannous oxide powder and method for producing sameJX ADVANCED METALS CORP·Filed 2018·Granted May 13, 2025·0 cites·17 claims
- 1961US8283051B2Plated product having copper thin film formed thereon by electroless platingITO JUNICHI·Filed 2009·Granted Oct 9, 2012·1 cites·5 claims
- 2060US8089154B2Electronic component formed with barrier-seed layer on base materialSEKIGUCHI JUNNOSUKE·Filed 2009·Granted Jan 3, 2012·1 cites·5 claims
- 2160US7867564B2Metal plating method and pretreatment agentNIPPON MINING CO·Filed 2003·Granted Jan 11, 2011·4 cites·7 claims
- 2257US12129529B2Oxidation-resistant metallic tinJX NIPPON MINING & METALS CORP·Filed 2020·Granted Oct 29, 2024·0 cites·8 claims
- 2356US11118276B2High purity tin and method for producing sameJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 14, 2021·0 cites·9 claims
- 2455US8004082B2Electronic component formed with barrier-seed layer on base materialNIPPON MINING CO·Filed 2009·Granted Aug 23, 2011·0 cites·5 claims
- 2555US6809138B2Adhesion accelerator for bonding rubber to metal and rubber compositionNIKKO MATERIALS CO LTD·Filed 2002·Granted Oct 26, 2004·1 cites·21 claims
- 2654US2016097139A1Method For Manufacturing High Purity Tin, Electrowinning Apparatus For High Purity Tin And High Purity TinJX NIPPON MINING & METALS CORP·Filed 2015·Application pending·0 cites
- 2751US8318313B2Method for supporting metal nanoparticles and metal nanoparticles-carrying substrateIMORI TORU·Filed 2008·Granted Nov 27, 2012·0 cites·12 claims
- 2850US10781024B2Method for vacuum packing high-purity tin and vacuum-packed high purity tinJX NIPPON MINING & METALS CORP·Filed 2017·Granted Sep 22, 2020·0 cites·12 claims
- 2950US8390123B2ULSI micro-interconnect member having ruthenium electroplating layer on barrier layerSEKIGUCHI JUNNOSUKE·Filed 2009·Granted Mar 5, 2013·0 cites·11 claims
- 3049US8736057B2Substrate and manufacturing method thereforITO JUNICHI·Filed 2008·Granted May 27, 2014·0 cites·8 claims
- 3149US8247301B2Substrate and manufacturing method thereforITO JUNICHI·Filed 2008·Granted Aug 21, 2012·0 cites·9 claims
- 3249US8182873B2Method for electroless plating and metal-plated articleIMORI TORU·Filed 2004·Granted May 22, 2012·2 cites·14 claims
- 3349US5284977AProcess for producing high-purity organic phosphineNIPPON MINING CO·Filed 1992·Granted Feb 8, 1994·6 cites·13 claims
- 3449US2007269680A1Electroless Plating Pretreatment Agent and Copper-Clad Laminate for Flexible SubstrateKAWAMURA TOSHIFUMI·Filed 2005·Application pending·0 cites
- 3548US8814997B2Electroless plating pretreatment agent, electroless plating method using same, and electroless plated objectIMORI TORU·Filed 2011·Granted Aug 26, 2014·0 cites·10 claims
- 3647US8333834B2High-purity aqueous copper sulfonate solution and method of producing sameSEKIGUCHI JUNNOSUKE·Filed 2011·Granted Dec 18, 2012·0 cites·5 claims
- 3746US9823362B2Radiation detector UBM electrode structure body, radiation detector, and method of manufacturing sameJX NIPPON MINING & METALS CORP·Filed 2016·Granted Nov 21, 2017·0 cites·6 claims
- 3845US8394508B2Plated article having metal thin film formed by electroless platingYABE ATSUSHI·Filed 2008·Granted Mar 12, 2013·0 cites·10 claims
- 3945US8163400B2Plated article having metal thin film formed by electroless plating, and manufacturing method thereofYABE ATSUSHI·Filed 2008·Granted Apr 24, 2012·0 cites·22 claims
- 4045US2006135584A1Novel imidazole alcohol compound, process for producing the same, and surface-treating agent comprising the sameIMORI TORU·Filed 2003·Application pending·0 cites
- 4144US8697233B2Metal-coated lipid bilayer vesicles and process for producing sameKIKUCHI JUN-ICHI·Filed 2006·Granted Apr 15, 2014·0 cites·22 claims
- 4244US2008224313A1Method for forming a seed layer for damascene copper wiring, and semiconductor wafer with damascene copper wiring formed using the methodYABE ATSUSHI·Filed 2008·Application pending·0 cites
- 4344US2008023669A1Metal Surface Treatment Agent for Promoting Rubber-Metal AdhesionIMORI TORU·Filed 2005·Application pending·0 cites
- 4443US2008003366A1Method of forming a conducting layer on a conducting and non-conducting substrateDUBIN VALERY M·Filed 2006·Application pending·0 cites
- 4542US8395264B2Substrate comprising alloy film of metal element having barrier function and metal element having catalytic powerITO JUNICHI·Filed 2010·Granted Mar 12, 2013·0 cites·10 claims
- 4642US6482965B2Molybdenum soap-containing metallic soap and method for producing the sameJAPAN ENERGY CORP·Filed 2001·Granted Nov 19, 2002·0 cites·8 claims
- 4741US8404035B2Electroless copper plating solutionYABE ATSUSHI·Filed 2004·Granted Mar 26, 2013·0 cites·1 claims
- 4840US2007120880A1Inkjet ink compositionKAWAMURA TOSHIFUMI·Filed 2004·Application pending·0 cites
- 4939US5488091AHigh molecular weight polystannanes by metal-catalyzed dehydropolymerizationUNIV CALIFORNIA·Filed 1994·Granted Jan 30, 1996·7 cites·33 claims
- 5035US5994434AAdhesion promoter composition and adherent rubber composition containing the sameBRIDGESTONE CORP·Filed 1997·Granted Nov 30, 1999·8 cites·19 claims
Showing the top 50 of 53 patent records by PatentIndex Score.
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