Inventor
LANDERS WILLIAM FRANCIS
US15 patents
⚠️ This page may combine multiple inventors who share the name “LANDERS WILLIAM FRANCIS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
13 patentsUS5676587AOct 14, 1997
Selective polish process for titanium, titanium nitride, tantalum and tantalum nitride
IBM231 citations95
US5953115ASep 14, 1999
Method and apparatus for imaging surface topography of a wafer
IBM35 citations92
US11469485B2Oct 11, 2022
Embedded microstrip transmission line
IBM5 citations83
US7714452B2May 11, 2010
Structure and method for producing multiple size interconnections
IBM15 citations82
US7009280B2Mar 7, 2006
Low-k interlevel dielectric layer (ILD)
IBM15 citations80
US11458474B2Oct 4, 2022
Microfluidic chips with one or more vias
IBM3 citations69
US5897425AApr 27, 1999
Vertical polishing tool and method
IBM8 citations65
US8386977B2Feb 26, 2013
Circuit design checking for three dimensional chip technology
IBM3 citations62
US6291833B2Sep 18, 2001
Apparatus for mapping scratches in an oxide film
IBM2 citations62
US6048745AApr 11, 2000
Method for mapping scratches in an oxide film
IBM4 citations62
US12166260B2Dec 10, 2024
Embedded microstrip transmission line
IBM0 citations61
US5968841AOct 19, 1999
Device and method for preventing settlement of particles on a chemical-mechanical polishing pad
IBM5 citations59
US8367543B2Feb 5, 2013
Structure and method to improve current-carrying capabilities of C4 joints
IBM0 citations37