Inventor
KAMPHUIS ANTONIUS HENDRIKUS JOZEF
NL24 patents
⚠️ This page may combine multiple inventors who share the name “KAMPHUIS ANTONIUS HENDRIKUS JOZEF”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
NXP BV
19 patentsUS11380634B2Jul 5, 2022
Apparatuses and methods for coupling a waveguide structure to an integrated circuit package
NXP BV2 citations66
US12142527B2Nov 12, 2024
Method and system for regulating plasma dicing rates
NXP BV2 citations65
US11721586B2Aug 8, 2023
Method and system for regulating plasma dicing rates
NXP BV2 citations65
US7726011B2Jun 1, 2010
Chip transfer method and apparatus
NXP BV7 citations65
US10998489B2May 4, 2021
Magnetic shielding structure for MRAM array
NXP BV1 citations62
US10896878B2Jan 19, 2021
Integrated circuit saw bow break point
NXP BV0 citations60
US12315995B2May 27, 2025
Grounding assembly for a semiconductor device
NXP BV0 citations59
US11881425B2Jan 23, 2024
Technique for handling diced wafers of integrated circuits
NXP BV0 citations59
US11658056B2May 23, 2023
Technique for handling diced wafers of integrated circuits
NXP BV0 citations59
US11508606B2Nov 22, 2022
Technique for handling diced wafers of integrated circuits
NXP BV0 citations59
US12446199B2Oct 14, 2025
On-chip shielded device
NXP BV0 citations55
US10593635B2Mar 17, 2020
Multi-die and antenna array device
NXP BV1 citations54
US11133578B2Sep 28, 2021
Semiconductor device package comprising an encapsulated and conductively shielded semiconductor device die that provides an antenna feed to a waveguide
NXP BV0 citations50
US12212074B2Jan 28, 2025
Single die design for different polarizations
NXP BV0 citations49
US12114472B2Oct 8, 2024
RF component and method
NXP BV0 citations49
US12199333B2Jan 14, 2025
Semiconductor device having uniform multi-package antenna array and method of manufacture
NXP BV0 citations46
US10431476B2Oct 1, 2019
Method of making a plurality of packaged semiconductor devices
NXP BV0 citations38
US10643957B2May 5, 2020
Conformal dummy die
NXP BV0 citations35
US10431575B2Oct 1, 2019
Multi-die array device
NXP BV0 citations35
NXP USA INC
5 patentsUS12588517B2Mar 24, 2026
Semiconductor device with self-aligned waveguide and method therefor
NXP USA INC0 citations62
US12033950B2Jul 9, 2024
Semiconductor device with self-aligned waveguide and method therefor
NXP USA INC0 citations62
US12588557B2Mar 24, 2026
Multichip packages with 3D integration
NXP USA INC0 citations52
US12538844B2Jan 27, 2026
Double-sided multichip packages
NXP USA INC0 citations52
US10942444B2Mar 9, 2021
Optical control modules for integrated circuit device patterning and reticles and methods including the same
NXP USA INC0 citations43