Inventor

KIM JIN SU

KR114 patents

⚠️ This page may combine multiple inventors who share the name “KIM JIN SU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM JIN SU

SAMSUNG ELECTRONICS CO LTD

Semiconductor package

Semiconductor device and method for manufacturing the same

Etchant composition for indium oxide layer and etching method using the same

Electronic apparatus and controlling method thereof

Fan-out semiconductor package

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package and antenna module including the same

Fan-out semiconductor package

Fan-out semiconductor package

Method of detaching a pellicle from a photomask

Pellicle and exposure mask including the same

Fan-out semiconductor package module

Method and apparatus for charging a battery

Fan-out semiconductor package

CORNING INC

Integrated circuit packages having electrical and optical connectivity and methods of making the same

Vacuum insulated glass units and methodology for manufacturing the same

Laser welded glass packages

Integrated circuit packages having electrical and optical connectivity and methods of making the same

Glass laminate with buried stress spikes to arrest cracks and methods of making the same

Hermetically sealed optically transparent wafer-level packages and methods for making the same

Low warp fan-out processing method and production of substrates therefor

Precision structured glass articles, integrated circuit packages, optical devices, microfluidic devices, and methods for making the same

Methods for making high density vias in a glass article

Carrier for back end of line processing

LG INNOTEK CO LTD

Lighting device with light diffusing element

Lighting device having non-planar diffuser with array of 3D elements

Lighting device having diffuser with array of 3D elements

Lighting device using line shaped beam

Light source module and lighting device having the same

Lighting device using line shaped beam

Optical member having three-dimensional effect forming portion and multiple effect forming portion and lighting device using the same

Optical member and lighting device using the same

SAMSUNG ELECTRO MECH

Passivation layer having an opening for under bump metallurgy

Semiconductor device

Semiconductor device

Semiconductor device

Fan-out semiconductor package

Fan-out semiconductor package

Semiconductor package with improved signal stability and method of manufacturing the same

SK HYNIX INC

Method for processing image signal, image signal processor, and image sensor chip

Image sensing device using interpolated images to generate refined images

Image sensing device

HYUNDAI ELECTRONICS IND

Stacked semiconductor chip package having external terminal pads and stackable chips having a protection layer

Method of making stackable semiconductor chips to build a stacked chip module

LG ELECTRONICS INC

Cellular phone

Mobile phone

KIM JIN SU

Method for manufacturing a wire grid polarizer

LG DISPLAY CO LTD

Array substrate and method of fabricating the same

UNIV AJOU IND ACADEMIC COOP FOUND

Non-infrastructure ultra-wideband wireless positioning method and system using latency communication and overhear