US12103888B2ActiveUtilityA1

Methods for making high density vias in a glass article

57
Assignee: CORNING INCPriority: Apr 3, 2018Filed: Apr 2, 2019Granted: Oct 1, 2024
Est. expiryApr 3, 2038(~11.7 yrs left)· nominal 20-yr term from priority
C03C 23/0025C03C 23/0005C03C 23/002C03C 3/097C03C 3/093C03C 3/091C03C 3/087B32B 17/06C03C 27/06C03C 15/00
57
PatentIndex Score
0
Cited by
24
References
12
Claims

Abstract

A method for forming a via in a glass article includes forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate including a glass cladding layer and a glass central core layer, where the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and where the one or more cavities extend through the glass central core layer terminating at the glass cladding layer, depositing a metallic material within the one or more cavities, and removing the glass cladding layer.

Claims

exact text as granted — not AI-modified
What is claimed is: 
     
       1. A method for forming a via in a glass article, the method comprising:
 forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate comprising: (i) a glass cladding layer and a glass central core layer and (ii) an upper glass cladding layer coupled to a surface of the glass central core layer, 
 wherein the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and wherein the one or more cavities extend through the glass central core layer terminating at the glass cladding layer; 
 depositing a metallic material within the one or more cavities; and 
 removing the glass cladding layer; the method further comprising removing the upper glass cladding layer prior to forming the one or more cavities within the glass substrate. 
 
     
     
       2. The method of  claim 1 , wherein the glass cladding layer has a photosensitivity that is lower than a photosensitivity of the glass central core layer. 
     
     
       3. The method of  claim 1 , wherein the glass cladding layer is a lower glass cladding layer and the upper glass cladding layer is coupled to a surface of the glass central core layer opposite of the lower glass cladding layer. 
     
     
       4. The method of  claim 3 , wherein the one or more cavities are formed within the upper glass cladding layer. 
     
     
       5. The method of  claim 1 , wherein the etchant used to form the one or more cavities is a second etchant, and wherein removing the upper glass cladding layer comprises exposing the upper glass cladding layer to a first etchant that is different than the second etchant. 
     
     
       6. A method for forming a via in a glass article, the method comprising:
 forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate comprising a glass cladding layer and a glass central core layer, wherein the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and wherein the one or more cavities extend through the glass central core layer terminating at the glass cladding layer; 
 depositing a metallic material within the one or more cavities; and 
 removing the glass cladding layer, 
 
       wherein the glass cladding layer is a lower glass cladding layer and the glass substrate further comprises an upper glass cladding layer coupled to a surface of the glass central core layer opposite of the lower glass cladding layer, wherein the one or more cavities are formed within the upper glass cladding layer, wherein forming the one or more cavities within the upper glass cladding layer comprises exposing the upper glass cladding layer to a first etchant, and wherein forming the one or more cavities within the glass central core layer comprises exposing the glass central core layer to a second etchant that is different than the first etchant. 
     
     
       7. A method for forming a via in a glass article, the method comprising:
 forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate comprising a glass cladding layer and a glass central core layer, wherein the glass cladding layer has an etch rate in the etchant that is different than an etch rate of the glass central core layer, and wherein the one or more cavities extend through the glass central core layer terminating at the glass cladding layer; 
 depositing a metallic material within the one or more cavities; and 
 removing the glass cladding layer, wherein the glass cladding layer is a lower glass cladding layer and the glass substrate further comprises an upper glass cladding layer coupled to a surface of the glass central core layer opposite of the lower glass cladding layer, wherein the etchant used to form the one or more cavities is a second etchant, and wherein removing the lower glass cladding layer comprises exposing the lower glass cladding layer to a first etchant that is different than the second etchant. 
 
     
     
       8. A method for forming a via in a glass article, the method comprising:
 forming one or more cavities within a glass substrate by exposing the glass substrate to an etchant, the glass substrate comprising an upper glass cladding layer, a glass central core layer, and a lower glass cladding layer, wherein the one or more cavities extend through the upper glass cladding layer, and wherein the upper glass cladding layer and the lower glass cladding layer have an etch rate in the etchant that is different than an etch rate of the glass central core layer; 
 depositing metallic material within the one or more cavities of the upper glass cladding layer; and 
 removing the lower glass cladding layer from the glass substrate; and further comprising removing the glass central core layer from the glass substrate. 
 
     
     
       9. The method of  claim 8 , wherein the etchant used to form the one or more cavities is a first etchant, and wherein removing the glass central core layer from the glass substrate comprises exposing the glass central core layer to a second etchant that is different than the first etchant. 
     
     
       10. The method of  claim 8 , wherein removing the lower glass cladding layer comprises exposing the lower glass cladding layer to the first etchant. 
     
     
       11. The method of  claim 8 , wherein forming the one or more cavities comprises forming the one or more cavities to extend through the upper glass cladding layer and the glass central core layer, terminating at the lower glass cladding layer. 
     
     
       12. The method of  claim 8 , wherein forming the one or more cavities in the upper glass cladding layer comprises exposing the upper glass cladding layer to electromagnetic radiation.

Cited by (0)

No later patents cite this yet.

References (0)

No backward citations on record.