Inventor · disambiguated record
Takumi Nakahata
Also filed as: NAKAHATA TAKUMI
14 granted patents·2 pending applications·213 citations·filing 1997–2009
91Inventor score
Top patents by PatentIndex Score
16 records- 0197US7834962B2Liquid crystal displayMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Nov 16, 2010·106 cites·6 claims
- 0284US8040476B2Display device and method of producing the sameMITSUBISHI ELECTRIC CORP·Filed 2009·Granted Oct 18, 2011·6 cites·12 claims
- 0373US6635938B1Semiconductor device and manufacturing method thereofMITSUBISHI ELECTRIC CORP·Filed 2000·Granted Oct 21, 2003·19 cites·22 claims
- 0473US6228728B1Method of fabricating semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 1999·Granted May 8, 2001·35 cites·20 claims
- 0565US7825515B2Semiconductor device, display device, and method of manufacturing semiconductor deviceMITSUBISHI ELECTRIC CORP·Filed 2008·Granted Nov 2, 2010·3 cites·10 claims
- 0661US6417534B2Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 1998·Granted Jul 9, 2002·18 cites·12 claims
- 0753US6316320B1DRAM device with improved memory cell reliabilityMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Nov 13, 2001·15 cites·12 claims
- 0851US8841541B2Solar battery and method of manufacturing the sameNAKAHATA TAKUMI·Filed 2009·Granted Sep 23, 2014·0 cites·15 claims
- 0951US8558248B2A1 alloy film, electronic device, and active matrix substrate for use in electrooptic display deviceINOUE KAZUNORI·Filed 2008·Granted Oct 15, 2013·0 cites·20 claims
- 1048US6828182B2Epitaxial thin film forming methodMITSUBISHI ELECTRIC CORP·Filed 2002·Granted Dec 7, 2004·2 cites·7 claims
- 1144US6232192B1Method of manufacturing semiconductor device having sidewall portions removedMITUBISHI DENKI KABUSHIKI KAIS·Filed 2000·Granted May 15, 2001·1 cites·12 claims
- 1238US8405091B2Display device and method of manufacturing the sameNAKAHATA TAKUMI·Filed 2008·Granted Mar 26, 2013·0 cites·2 claims
- 1337US2006273422A1Switching element for characteristic inspection, and characteristic inspection methodMITSUBISHI ELECTRIC CORP·Filed 2006·Application pending·0 cites
- 1437US2002140019A1Semiconductor device and method of fabricating the sameMITSUBISHI ELECTRIC CORP·Filed 2002·Application pending·0 cites
- 1536US6373108B1Semiconductor device having reduced sheet resistance of source/drain regionsMITSUBISHI ELECTRIC CORP·Filed 1999·Granted Apr 16, 2002·5 cites·7 claims
- 1634US6465851B1Dram device with improved memory cell reliabilityMITSUBISHI ELECTRIC CORP·Filed 1997·Granted Oct 15, 2002·3 cites·2 claims
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