Inventor

HIGGINS III LEO M

US60 patents

⚠️ This page may combine multiple inventors who share the name “HIGGINS III LEO M”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HIGGINS III LEO M

MOTOROLA INC

Semiconductor device having a sub-chip-scale package structure and method for forming same

Shielded electronic component assembly and method for making the same

Pad array semiconductor device having a heat sink with die receiving cavity

Method for forming conductive bumps on a semiconductor device

Semiconductor device having compliant columnar electrical connections

Area array semiconductor device having a lid with functional contacts

Method for testing a semiconductor device on a universal test circuit substrate

Method of forming semiconductor device having a sub-chip-scale package structure

Process for underfilling a flip-chip semiconductor device

Z-axis compliant mechanical IC wiring substrate and method for making the same

Semiconductor device with integral decoupling capacitor

Semiconductor device having a particular lid means and encapsulant to reduce die stress

Semiconductor device having voltage distribution ring(s) and method for making the same

Method for making a tab semiconductor device with self-aligning cavity and intrinsic standoff

Tape automated bonding (TAB) semiconductor device with ground plane and method for making the same

TAB tape translator for use with semiconductor devices

Tape automated bonding(tab)semiconductor device and method for making the same

Tab semiconductor device having die edge protection and method for making the same

Method for making tape automated bonding (TAB) semiconductor device

HIGGINS III LEO M

Method for protecting copper wire bonds on aluminum pads of a semiconductor device from corrosion

Packaged semiconductor device

Thermally enhanced package with lid heat spreader

Thermally enhanced package with lid heat spreader

Packaging for semiconductor sensor devices and methods

Method for forming a semiconductor device assembly having a heat spreader

Method for forming die assembly with heat spreader

Copper ball bond features and structure

FREESCALE SEMICONDUCTOR INC

Die-to-die inductive communication devices and methods

Sensing field effect transistor devices and method of their manufacture

Method and apparatus for assembling a semiconductor package

Encapsulant for a semiconductor device

Encapsulant for a semiconductor device

Semiconductor device having a protective material with a first pH formed around cooper wire bonds and aluminum pads for neutralizes a second pH of an outer encapsulant material

PRIME COMPUTER INC

Heat sink apparatus with an air deflection member

Circuit board fabrication

Heat sink apparatus

Circuit board construction

Elastomeric test probe

ASAT LTD

Thin array plastic package without die attach pad and process for fabricating the same

Integrated circuit package and method for fabricating same

Integrated circuit package and method for fabricating same

MATHEW VARUGHESE

Method for treating a bond pad of a package substrate

Surface finish for wirebonding

Mold compound compatibility test system and methods thereof

NXP USA INC

Laser sintered interconnections between die

Packaged integrated circuit having stacked die and method for therefor

CARPENTER BURTON J

Semiconductor device assembly having a heat spreader

Integrated circuit die assembly with heat spreader

CABOT TECHNICAL CERAMICS INC

High density integrated circuit package

UEHLING TRENT S

Semiconductor devices with compliant interconnects