Inventor
ITABASHI TAKEYUKI
JP33 patents
⚠️ This page may combine multiple inventors who share the name “ITABASHI TAKEYUKI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
HITACHI LTD
26 patentsUS6680540B2Jan 20, 2004
Semiconductor device having cobalt alloy film with boron
HITACHI LTD205 citations99
US5595943AJan 21, 1997
Method for formation of conductor using electroless plating
HITACHI LTD125 citations98
US6370768B1Apr 16, 2002
Circuit board, a method for manufacturing same, and a method of electroless plating
HITACHI LTD71 citations96
US6300244B1Oct 9, 2001
Semiconductor device and method of manufacturing the same
HITACHI LTD57 citations95
US6805915B2Oct 19, 2004
Electroless copper plating solution, electroless copper plating process and production process of circuit board
HITACHI LTD15 citations92
US6326561B1Dec 4, 2001
Thin-film multilayer wiring board with wiring and via holes in a thickness of an insulating layer
HITACHI LTD39 citations92
US6190493B1Feb 20, 2001
Thin-film multilayer wiring board and production thereof
HITACHI LTD31 citations92
US5457079AOct 10, 1995
Copper-based oxidation catalyst and its applications
HITACHI LTD25 citations91
US5294291AMar 15, 1994
Process for the formation of a conductive circuit pattern
HITACHI LTD24 citations89
US7568452B2Aug 4, 2009
Engine system
HITACHI LTD15 citations84
US7352184B2Apr 1, 2008
MRI apparatus with high-resistance magnet
HITACHI LTD10 citations84
US7235324B2Jun 26, 2007
Catalyst material and method of manufacturing the same and fuel cell using the same
HITACHI LTD10 citations84
US6495769B1Dec 17, 2002
Wiring board and production method thereof, and semiconductor apparatus
HITACHI LTD17 citations84
US7805271B2Sep 28, 2010
Evaluation system for amount of emission gases through fuel supply chain
HITACHI LTD15 citations83
US7667343B2Feb 23, 2010
Hydrogen production system using wind turbine generator
HITACHI LTD13 citations83
US6511588B1Jan 28, 2003
Plating method using an additive
HITACHI LTD19 citations83
US6831009B2Dec 14, 2004
Wiring substrate and an electroless copper plating solution for providing interlayer connections
HITACHI LTD7 citations73
US5788821AAug 4, 1998
Copper-based oxidation catalyst and its application
HITACHI LTD5 citations72
US7806991B2Oct 5, 2010
Low loss magnet and magnetic circuit using the same
HITACHI LTD3 citations63
US7527660B2May 5, 2009
Hydrogen fuel manufacturing method and system with control program for use therein
HITACHI LTD3 citations62
US7226690B2Jun 5, 2007
Catalyst material and method of manufacturing the same and fuel cell using the same
HITACHI LTD4 citations62
US7169216B2Jan 30, 2007
Electroless copper plating solution, electroless copper plating process and production process of circuit board
HITACHI LTD4 citations62
US6989329B2Jan 24, 2006
Method of manufacturing a wiring substrate and an electroless copper plating solution for providing interlayer connections
HITACHI LTD3 citations62
US6900394B1May 31, 2005
Electroless copper plating machine, and multi-layer printed wiring board
HITACHI LTD5 citations62
US7847555B2Dec 7, 2010
MRI apparatus with high-resistance magnet
HITACHI LTD0 citations52
US7579275B2Aug 25, 2009
Electric plating method, electric plating apparatus, program for plating, recording medium, and manufacturing method and manufacturing apparatus for semiconductor device
HITACHI LTD0 citations52
HITACHI METALS LTD
3 patentsUS8368195B2Feb 5, 2013
Semiconductor device including arrangement to control connection height and alignment between a plurity of stacked semiconductor chips
HITACHI METALS LTD9 citations82
US8020745B2Sep 20, 2011
Solder ball
HITACHI METALS LTD2 citations62
US8053908B2Nov 8, 2011
Semiconductor device
HITACHI METALS LTD4 citations60