Inventor · disambiguated record
Yukinori Oda
Also filed as: ODA YUKINORI
7 granted patents·5 pending applications·11 citations·filing 2006–2024
74Inventor score
Top patents by PatentIndex Score
12 records- 0171US7678183B2Electroless palladium plating bath and electroless palladium plating methodUYEMURA C & CO LTD·Filed 2006·Granted Mar 16, 2010·9 cites·11 claims
- 0267US11718916B2Electroless Co—W plating filmUEMURA KOGYO KK·Filed 2022·Granted Aug 8, 2023·0 cites·7 claims
- 0365US2024360586A1Method and system for regenerating electrolytic copper plating solutionUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 0464US8124174B2Electroless gold plating method and electronic partsKUROSAKA SEIGO·Filed 2008·Granted Feb 28, 2012·2 cites·6 claims
- 0563US10947623B2Electroless plating bathUEMURA KOGYO KK·Filed 2019·Granted Mar 16, 2021·0 cites·2 claims
- 0655US2024218518A1Electroless ruthenium plating bathUEMURA KOGYO KK·Filed 2023·Application pending·0 cites
- 0754US7985285B2Electroless gold plating bath, electroless gold plating method and electronic partsUYEMURA C & CO LTD·Filed 2007·Granted Jul 26, 2011·0 cites·11 claims
- 0852US2020205298A1Heat-resistant power module substrate, heat-resistant plating film and plating solutionUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 0947US10763204B2Semiconductor deviceDENSO CORP·Filed 2019·Granted Sep 1, 2020·0 cites·6 claims
- 1047US2019200461A1Heat-resistant power module substrate, heat-resistant plating film and plating solutionUEMURA KOGYO KK·Filed 2018·Application pending·0 cites
- 1144US11049838B2Conductive bump and electroless Pt plating bathUEMURA KOGYO KK·Filed 2019·Granted Jun 29, 2021·0 cites·13 claims
- 1241US2021262096A1Electroless copper plating bathUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
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