Assignee
UEMURA KOGYO KK
JP·66 granted patents·31 pending applications·592 citations·filing 1980–2025
Top patents by PatentIndex Score
97 records- 0194US10513779B2Surface treating apparatusUEMURA KOGYO KK·Filed 2017·Granted Dec 24, 2019·6 cites·4 claims
- 0286US10138558B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUEMURA KOGYO KK·Filed 2016·Granted Nov 27, 2018·3 cites·6 claims
- 0385US11001929B2Surface treating apparatusUEMURA KOGYO KK·Filed 2019·Granted May 11, 2021·1 cites·11 claims
- 0485US5266181AControlled composite deposition methodUEMURA KOGYO KK·Filed 1992·Granted Nov 30, 1993·45 cites·18 claims
- 0582US11001928B2Surface treating apparatusUEMURA KOGYO KK·Filed 2019·Granted May 11, 2021·3 cites·11 claims
- 0681US11173513B2Surface treatment device comprising a paddle for stirring a surface treatment solution, paddle for stirring a surface treatment solution and method thereofUEMURA KOGYO KK·Filed 2019·Granted Nov 16, 2021·2 cites·9 claims
- 0781US5364460AElectroless gold plating bathUEMURA KOGYO KK·Filed 1994·Granted Nov 15, 1994·57 cites·8 claims
- 0881US4484936ADegassing assemblyUEMURA KOGYO KK·Filed 1982·Granted Nov 27, 1984·40 cites·3 claims
- 0979US10576492B2Surface treating apparatusUEMURA KOGYO KK·Filed 2017·Granted Mar 3, 2020·1 cites·8 claims
- 1078US10669643B2Clamper and holding jig including sameUEMURA KOGYO KK·Filed 2017·Granted Jun 2, 2020·3 cites·2 claims
- 1178US5232744AElectroless composite plating bath and methodUEMURA KOGYO KK·Filed 1991·Granted Aug 3, 1993·39 cites·9 claims
- 1277US11887882B2Holding jigUEMURA KOGYO KK·Filed 2019·Granted Jan 30, 2024·2 cites·8 claims
- 1377US11047814B2X-ray fluorescence analysis measurement method and X-ray fluorescence analysis measurement deviceUEMURA KOGYO KK·Filed 2018·Granted Jun 29, 2021·1 cites·9 claims
- 1475US10450666B2Copper plating solution and copper plating methodUEMURA KOGYO KK·Filed 2017·Granted Oct 22, 2019·1 cites·4 claims
- 1574US10477695B2Drying apparatusUEMURA KOGYO KK·Filed 2017·Granted Nov 12, 2019·2 cites·13 claims
- 1674US4746412AIron-phosphorus electroplating bath and electroplating method using sameUEMURA KOGYO KK·Filed 1986·Granted May 24, 1988·27 cites·17 claims
- 1774US4650691AElectroless copper plating bath and methodUEMURA KOGYO KK·Filed 1984·Granted Mar 17, 1987·28 cites·26 claims
- 1874US4353933AMethod for controlling electroless plating bathUEMURA KOGYO KK·Filed 1980·Granted Oct 12, 1982·24 cites·5 claims
- 1973US4615145AApparatus for mechanically finishing workpiecesUEMURA KOGYO KK·Filed 1984·Granted Oct 7, 1986·17 cites·10 claims
- 2073US4350717AControlling electroless plating bathUEMURA KOGYO KK·Filed 1980·Granted Sep 21, 1982·22 cites·16 claims
- 2171US10995407B2Surface treating apparatus and surface treatment methodUEMURA KOGYO KK·Filed 2019·Granted May 4, 2021·1 cites·11 claims
- 2271US4441965ACodeposition methodUEMURA KOGYO KK·Filed 1983·Granted Apr 10, 1984·18 cites·9 claims
- 2370US4541902AAnalytical method for determining formaldehyde in electroless copper plating bathUEMURA KOGYO KK·Filed 1984·Granted Sep 17, 1985·25 cites·10 claims
- 2468US2026085426A1Electroless ruthenium plating bathUEMURA KOGYO KK·Filed 2025·Application pending·0 cites
- 2567US11718916B2Electroless Co—W plating filmUEMURA KOGYO KK·Filed 2022·Granted Aug 8, 2023·0 cites·7 claims
- 2666US4913787AGold plating bath and methodUEMURA KOGYO KK·Filed 1989·Granted Apr 3, 1990·13 cites·9 claims
- 2765US2024360586A1Method and system for regenerating electrolytic copper plating solutionUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 2865US2024200196A1Catalyst application bath for electroless plating, method of producing catalytic nucleus-containing material to be electroless plated, method of producing material with electroless plating deposit, and material with electroless plating depositUEMURA KOGYO KK·Filed 2023·Application pending·0 cites
- 2964US12454760B2Etchant and method of surface treatment of aluminum or aluminum alloyUEMURA KOGYO KK·Filed 2023·Granted Oct 28, 2025·0 cites·7 claims
- 3064US5266103ABath and method for the electroless plating of tin and tin-lead alloyUEMURA KOGYO KK·Filed 1992·Granted Nov 30, 1993·25 cites·12 claims
- 3164US2021047734A1Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 3263US10947623B2Electroless plating bathUEMURA KOGYO KK·Filed 2019·Granted Mar 16, 2021·0 cites·2 claims
- 3363US5434024AElectrodeUEMURA KOGYO KK·Filed 1993·Granted Jul 18, 1995·37 cites·9 claims
- 3463US2020002830A1Copper plating solution and copper plating methodUEMURA KOGYO KK·Filed 2019·Application pending·0 cites
- 3562US11946144B2Electroless palladium plating solutionUEMURA KOGYO KK·Filed 2018·Granted Apr 2, 2024·0 cites·5 claims
- 3662US2024279814A1Apparatus for measuring plating deposition statusUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 3761US11814717B2Palladium plating solution and plating methodUEMURA KOGYO KK·Filed 2021·Granted Nov 14, 2023·0 cites·7 claims
- 3861US2024401221A1Workpiece Holding JigUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 3961US2024401222A1Workpiece Holding JigUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 4060US5217536AComposite plating apparatusUEMURA KOGYO KK·Filed 1991·Granted Jun 8, 1993·21 cites·4 claims
- 4159US5182131APlating solution automatic controlUEMURA KOGYO KK·Filed 1989·Granted Jan 26, 1993·19 cites·1 claims
- 4257US11421325B2Method for producing a printed wiring boardUEMURA KOGYO KK·Filed 2020·Granted Aug 23, 2022·0 cites·4 claims
- 4357US10927463B2Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2017·Granted Feb 23, 2021·0 cites·2 claims
- 4457US2022396881A1Method for fabricating electronic componentUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 4557US2023203665A1Regeneration method for gold plating solutionUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 4656US12503775B2Copper etching solutionUEMURA KOGYO KK·Filed 2022·Granted Dec 23, 2025·0 cites·10 claims
- 4756US10975475B2Electroless gold plating bathUEMURA KOGYO KK·Filed 2020·Granted Apr 13, 2021·0 cites·5 claims
- 4856US10822704B2Electroless platinum plating bathUEMURA KOGYO KK·Filed 2017·Granted Nov 3, 2020·0 cites·7 claims
- 4956US2022388279A1Multilayer plating filmUEMURA KOGYO KK·Filed 2022·Application pending·0 cites
- 5055US11891698B2Turbulence-reducing device for stirring a surface treatment solutionUEMURA KOGYO KK·Filed 2020·Granted Feb 6, 2024·0 cites·6 claims
Showing the top 50 of 97 patent records by PatentIndex Score.
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