Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring board

Abstract

A novel pretreating liquid for electroless plating which is used simultaneously with reduction treatment after roughening treatment of a filler-containing insulating resin substrate. A pretreating liquid for electroless plating is used simultaneously with reduction treatment when an insulating resin substrate containing a filler is roughened and residues generated on the insulating resin substrate are reduced. The pretreating liquid contains a reducing agent; and at least one selected from the group consisting of ethylene-based glycol ether represented by CmH(2m+1)-(OC 2 H 4 )n-OH (m=an integer of 1 to 4, n=an integer of 1 to 4) and propylene-based glycol ether represented by CxH(2x+1)-(OC 3 H 6 )y-OH (x=an integer of 1 to 4, y=an integer of 1 to 3).

1 - 3 . (canceled) 
     
     
         4 . A process for producing a printed wiring board, comprising:
 a roughening treatment step of roughening an insulating resin substrate containing a filler;   a reduction and filler removal step of reducing residues generated on the insulating resin substrate by the roughening treatment step and, at the same time, removing the filler contained in the resin insulating substrate; and   an electroless plating step of applying electroless plating to an insulating resin etched in the reduction and filler removal step,   wherein, in the reduction and filler removal step, a treating liquid containing a reducing agent and at least one selected from the group consisting of
 ethylene-based glycol ether represented by CmH(2m+1)-(OC 2 H 4 )n-OH,
 wherein m=an integer of 1 to 4 and n=an integer of 1 to 4, and 
 
 propylene-based glycol ether represented by CxH(2x+1)-(OC 3 H 6 )y-OH,
 wherein x=an integer of 1 to 4 and y=an integer of 1 to 3, is used. 
 
   
     
     
         5 . The production process according to  claim 4 , wherein, in the reduction and filler removal step, a treating liquid further comprising a fluorine compound is used. 
     
     
         6 . The production process according to  claim 4 , wherein the insulating resin substrate contains a silica-based filler, and the content of SiO 2  in the insulating resin substrate is 30% by mass or more. 
     
     
         7 . The production process according to  claim 5 , wherein the insulating resin substrate contains a silica-based filler, and the content of SiO 2  in the insulating resin substrate is 30% by mass or more.