Inventor · disambiguated record
Hisamitsu Yamamoto
Also filed as: YAMAMOTO HISAMITSU
15 granted patents·10 pending applications·21 citations·filing 2006–2024
87Inventor score
Top patents by PatentIndex Score
25 records- 0186US10138558B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUEMURA KOGYO KK·Filed 2016·Granted Nov 27, 2018·3 cites·6 claims
- 0282US8828131B2Catalyst application solution, electroless plating method using same, and direct plating methodYAMAMOTO HISAMITSU·Filed 2010·Granted Sep 9, 2014·5 cites·14 claims
- 0381US9359676B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Jun 7, 2016·3 cites·12 claims
- 0481US9120113B2Surface treating apparatusUYEMURA C & CO LTD·Filed 2013·Granted Sep 1, 2015·2 cites·7 claims
- 0575US10450666B2Copper plating solution and copper plating methodUEMURA KOGYO KK·Filed 2017·Granted Oct 22, 2019·1 cites·4 claims
- 0673US9374913B2Pretreatment agent for electroless plating, and pretreatment and production of printed wiring board using sameUYEMURA C & CO LTD·Filed 2014·Granted Jun 21, 2016·3 cites·4 claims
- 0764US2021047734A1Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 0863US8276270B2Method for manufacturing printed circuit boardHOTTA TERUYUKI·Filed 2008·Granted Oct 2, 2012·4 cites·2 claims
- 0963US2020002830A1Copper plating solution and copper plating methodUEMURA KOGYO KK·Filed 2019·Application pending·0 cites
- 1062US2024279814A1Apparatus for measuring plating deposition statusUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 1157US11421325B2Method for producing a printed wiring boardUEMURA KOGYO KK·Filed 2020·Granted Aug 23, 2022·0 cites·4 claims
- 1257US10927463B2Pretreating liquid for electroless plating to be used during reduction treatment, and process for producing printed wiring boardUEMURA KOGYO KK·Filed 2017·Granted Feb 23, 2021·0 cites·2 claims
- 1356US12503775B2Copper etching solutionUEMURA KOGYO KK·Filed 2022·Granted Dec 23, 2025·0 cites·10 claims
- 1453US2024351943A1Method of producing plating depositUEMURA KOGYO KK·Filed 2024·Application pending·0 cites
- 1549US10435778B2Surface treating apparatusUEMURA KOGYO KK·Filed 2017·Granted Oct 8, 2019·0 cites·11 claims
- 1649US2015289382A1Production method for printed wiring board and printed wiring board produced by said methodUYEMURA C & CO LTD·Filed 2013·Application pending·0 cites
- 1748US8992756B2Direct plating method and solution for palladium conductor layer formationYAMAMOTO HISAMITSU·Filed 2006·Granted Mar 31, 2015·0 cites·11 claims
- 1848US8877020B2Electrolytic regeneration unit and electrolytic regeneration apparatus using sameYAMAMOTO HISAMITSU·Filed 2012·Granted Nov 4, 2014·0 cites·14 claims
- 1948US2021289637A1Method for producing printed wiring boardUEMURA KOGYO KK·Filed 2017·Application pending·0 cites
- 2047US10773280B2Ultrasonic treatment apparatusUEMURA KOGYO KK·Filed 2017·Granted Sep 15, 2020·0 cites·14 claims
- 2143US2017253975A1Method for manufacturing wiring substrate and wiring substrate manufactured therebyUEMURA KOGYO KK·Filed 2015·Application pending·0 cites
- 2241US2021262096A1Electroless copper plating bathUEMURA KOGYO KK·Filed 2020·Application pending·0 cites
- 2339US9045836B2Electrolytic regeneration deviceSAIJO YOSHIKAZU·Filed 2011·Granted Jun 2, 2015·0 cites·9 claims
- 2435US2014339463A1Desmear solution and desmear methodSAIJO YOSHIKAZU·Filed 2012·Application pending·0 cites
- 2533US2012167916A1Neutralizing/reducing agent, and desmear methodSAIJO YOSHIKAZU·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →