Copper plating solution and copper plating method

Abstract

A copper plating solution includes: water-soluble copper salt; ethylenediamine; at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine; and at least one of hydantoin or a substituted derivative thereof. The copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper.

What is claimed is: 
     
         1 . A copper plating solution comprising:
 water-soluble copper salt;   ethylenediamine;   at least one of ethylenediaminetetraacetic acid (EDTA), a substituted derivative of EDTA, an ethylenediamine derivative, or glycine;   at least one of hydantoin or a substituted derivative thereof, and   at least one of hypophosphite or organic salt, and   wherein:   the copper plating solution allows an aluminum or aluminum alloy base to be displacement-plated with copper, and   wherein the at least one of EDTA, a substituted derivative of EDTA, an ethylenediamine derivative, or glycine has a molar ratio of 0.4 or more and 0.7 or less with respect to the ethylenediamine.   
     
     
         2 . The copper plating solution of  claim 1 , wherein the copper plating solution is free from nickel salt. 
     
     
         3 . A copper plating method comprising:
 a pretreatment process of pretreating a surface of an aluminum or aluminum alloy base; and   a copper plating process of displacement-plating the aluminum or aluminum alloy base with copper using the copper plating solution of  claim 1  after the pretreatment process,   
       wherein
 the copper plating process is performed on the aluminum or aluminum alloy base which is untreated with zincate. 
 
     
     
         4 . The copper plating method of  claim 3 , wherein the pretreatment process includes degreasing, alkali etching, and acid washing.