Inventor

TSAI HUNG-CHIA

TW18 patents

⚠️ This page may combine multiple inventors who share the name “TSAI HUNG-CHIA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TSAI HUNG-CHIA

TAIWAN SEMICONDUCTOR MFG CO LTD

Micro electromechanical system sensor and method of forming the same

MEMS devices including MEMS dies and connectors thereto

MEMS devices including MEMS dies and connectors thereto

MEMS devices including MEMS dies and connectors thereto

Vacuum sealed MEMS and CMOS package

Vacuum sealed MEMS and CMOS package

Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using through mold vias (TMVs)

Methods for packaging a microelectromechanical system (MEMS) wafer and application-specific integrated circuit (ASIC) dies using wire bonding

MEMS devices including MEMS dies and connectors thereto

Method of forming semiconductor package and semiconductor package

Method of forming micro electromechanical system sensor

Semiconductor device

Semiconductor device with through molding vias and method of making the same

Support structure for TSV in MEMS structure

TAIWAN SEMICONDUCTOR MFG

MEMS devices and methods for forming same

Semiconductor device

Semiconductor device with through molding vias

TSAI YI HENG

Support structure for TSV in MEMS structure