P

Inventor

CRONIN JOHN EDWARD

US55 patents
⚠️ This page may combine multiple inventors who share the name “CRONIN JOHN EDWARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

IBM

41 patents
US5818110AOct 6, 1998

Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same

IBM179 citations99
US5818748AOct 6, 1998

Chip function separation onto separate stacked chips

IBM243 citations99
US5781031AJul 14, 1998

Programmable logic array

IBM472 citations99
US5786628AJul 28, 1998

Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging

IBM127 citations98
US5670803ASep 23, 1997

Three-dimensional SRAM trench structure and fabrication method therefor

IBM140 citations98
US5719438AFeb 17, 1998

Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging

IBM97 citations97
US5691248ANov 25, 1997

Methods for precise definition of integrated circuit chip edges

IBM232 citations97
US5956575ASep 21, 1999

Microconnectors

IBM52 citations96
US5663101ASep 2, 1997

Semiconductor structure having multiple levels of self-aligned interconnection metallization, and methods for its preparation

IBM56 citations96
US5654221AAug 5, 1997

Method for forming semiconductor chip and electronic module with integrated surface interconnects/components

IBM72 citations96
US5925924AJul 20, 1999

Methods for precise definition of integrated circuit chip edges

IBM83 citations95
US5654238AAug 5, 1997

Method for etching vertical contact holes without substrate damage caused by directional etching

IBM119 citations95
US5668399ASep 16, 1997

Semiconductor device with increased on chip decoupling capacitance

IBM43 citations94
US5651857AJul 29, 1997

Sidewall spacer using an overhang

IBM61 citations94
US5960254ASep 28, 1999

Methods for the preparation of a semiconductor structure having multiple levels of self-aligned interconnection metallization

IBM32 citations93
US5955818ASep 21, 1999

Machine structures fabricated of multiple microstructure layers

IBM32 citations93
US5773361AJun 30, 1998

Process of making a microcavity structure and applications thereof

IBM23 citations93
US5763318AJun 9, 1998

Method of making a machine structures fabricated of mutiple microstructure layers

IBM36 citations93
US5760477AJun 2, 1998

Integrated circuit contacts having resistive electromigration characteristics

IBM17 citations93
US5696030ADec 9, 1997

Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor

IBM21 citations93
US6174763B1Jan 16, 2001

Three-dimensional SRAM trench structure and fabrication method therefor

IBM21 citations92
US5759911AJun 2, 1998

Self-aligned metallurgy

IBM36 citations92
US5760475AJun 2, 1998

Refractory metal-titanium nitride conductive structures

IBM68 citations92
US5656544AAug 12, 1997

Process for forming a polysilicon electrode in a trench

IBM39 citations92
US5861658AJan 19, 1999

Inorganic seal for encapsulation of an organic layer and method for making the same

IBM26 citations89
US5854141ADec 29, 1998

Inorganic seal for encapsulation of an organic layer and method for making the same

IBM32 citations89
US5679609AOct 21, 1997

Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses

IBM26 citations89
US5677563AOct 14, 1997

Gate stack structure of a field effect transistor

IBM32 citations89
US5882999AMar 16, 1999

Process for metallization of an insulation layer

IBM34 citations85
US5722879AMar 3, 1998

Variable travel carrier device and method for planarizing semiconductor wafers

IBM15 citations81
US6734564B1May 11, 2004

Specially shaped contact via and integrated circuit therewith

IBM6 citations74
US5665626ASep 9, 1997

Method of making a chimney capacitor

IBM14 citations74
US5976963ANov 2, 1999

Self-aligned metallurgy

IBM8 citations73
US5804853ASep 8, 1998

Stacked electrical device having regions of electrical isolation and electrical connections on a given stack level

IBM10 citations73
US5712190AJan 27, 1998

Process for controlling distance between integrated circuit chips in an electronic module

IBM9 citations73
US6576848B1Jun 10, 2003

Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same

IBM11 citations72
US6429473B1Aug 6, 2002

DRAM cell with stacked capacitor self-aligned to bitline

IBM7 citations71
US5760461AJun 2, 1998

Vertical mask for defining a region on a wall of a semiconductor structure

IBM12 citations71
US5739045AApr 14, 1998

Semiconductor device with increased on chip decoupling capacitance

IBM8 citations71
US5668018ASep 16, 1997

Method for defining a region on a wall of a semiconductor structure

IBM10 citations71
US5661330AAug 26, 1997

Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses

IBM9 citations71

WELLS FARGO BANK NA

5 patents

E INK CORP

1 patent

IP CAPITAL GROUP INC

1 patent

CRONIN JOHN EDWARD

1 patent

GARLAND STEPHEN DOUGLAS

1 patent

Showing the top 50 of 55 patents by PatentIndex Score.