Inventor
CRONIN JOHN EDWARD
US55 patents
⚠️ This page may combine multiple inventors who share the name “CRONIN JOHN EDWARD”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
IBM
41 patentsUS5818110AOct 6, 1998
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
IBM179 citations99
US5818748AOct 6, 1998
Chip function separation onto separate stacked chips
IBM243 citations99
US5781031AJul 14, 1998
Programmable logic array
IBM472 citations99
US5786628AJul 28, 1998
Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
IBM127 citations98
US5670803ASep 23, 1997
Three-dimensional SRAM trench structure and fabrication method therefor
IBM140 citations98
US5719438AFeb 17, 1998
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
IBM97 citations97
US5691248ANov 25, 1997
Methods for precise definition of integrated circuit chip edges
IBM232 citations97
US5956575ASep 21, 1999
Microconnectors
IBM52 citations96
US5663101ASep 2, 1997
Semiconductor structure having multiple levels of self-aligned interconnection metallization, and methods for its preparation
IBM56 citations96
US5654221AAug 5, 1997
Method for forming semiconductor chip and electronic module with integrated surface interconnects/components
IBM72 citations96
US5925924AJul 20, 1999
Methods for precise definition of integrated circuit chip edges
IBM83 citations95
US5654238AAug 5, 1997
Method for etching vertical contact holes without substrate damage caused by directional etching
IBM119 citations95
US5668399ASep 16, 1997
Semiconductor device with increased on chip decoupling capacitance
IBM43 citations94
US5651857AJul 29, 1997
Sidewall spacer using an overhang
IBM61 citations94
US5960254ASep 28, 1999
Methods for the preparation of a semiconductor structure having multiple levels of self-aligned interconnection metallization
IBM32 citations93
US5955818ASep 21, 1999
Machine structures fabricated of multiple microstructure layers
IBM32 citations93
US5773361AJun 30, 1998
Process of making a microcavity structure and applications thereof
IBM23 citations93
US5763318AJun 9, 1998
Method of making a machine structures fabricated of mutiple microstructure layers
IBM36 citations93
US5760477AJun 2, 1998
Integrated circuit contacts having resistive electromigration characteristics
IBM17 citations93
US5696030ADec 9, 1997
Integrated circuit contacts having improved electromigration characteristics and fabrication methods therefor
IBM21 citations93
US6174763B1Jan 16, 2001
Three-dimensional SRAM trench structure and fabrication method therefor
IBM21 citations92
US5759911AJun 2, 1998
Self-aligned metallurgy
IBM36 citations92
US5760475AJun 2, 1998
Refractory metal-titanium nitride conductive structures
IBM68 citations92
US5656544AAug 12, 1997
Process for forming a polysilicon electrode in a trench
IBM39 citations92
US5861658AJan 19, 1999
Inorganic seal for encapsulation of an organic layer and method for making the same
IBM26 citations89
US5854141ADec 29, 1998
Inorganic seal for encapsulation of an organic layer and method for making the same
IBM32 citations89
US5679609AOct 21, 1997
Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses
IBM26 citations89
US5677563AOct 14, 1997
Gate stack structure of a field effect transistor
IBM32 citations89
US5882999AMar 16, 1999
Process for metallization of an insulation layer
IBM34 citations85
US5722879AMar 3, 1998
Variable travel carrier device and method for planarizing semiconductor wafers
IBM15 citations81
US6734564B1May 11, 2004
Specially shaped contact via and integrated circuit therewith
IBM6 citations74
US5665626ASep 9, 1997
Method of making a chimney capacitor
IBM14 citations74
US5976963ANov 2, 1999
Self-aligned metallurgy
IBM8 citations73
US5804853ASep 8, 1998
Stacked electrical device having regions of electrical isolation and electrical connections on a given stack level
IBM10 citations73
US5712190AJan 27, 1998
Process for controlling distance between integrated circuit chips in an electronic module
IBM9 citations73
US6576848B1Jun 10, 2003
Integrated circuit chip wiring structure with crossover capability and method of manufacturing the same
IBM11 citations72
US6429473B1Aug 6, 2002
DRAM cell with stacked capacitor self-aligned to bitline
IBM7 citations71
US5760461AJun 2, 1998
Vertical mask for defining a region on a wall of a semiconductor structure
IBM12 citations71
US5739045AApr 14, 1998
Semiconductor device with increased on chip decoupling capacitance
IBM8 citations71
US5668018ASep 16, 1997
Method for defining a region on a wall of a semiconductor structure
IBM10 citations71
US5661330AAug 26, 1997
Fabrication, testing and repair of multichip semiconductor structures having connect assemblies with fuses
IBM9 citations71
WELLS FARGO BANK NA
5 patentsUS10339521B1Jul 2, 2019
Device enabled identification and authentication
WELLS FARGO BANK NA24 citations94
US10785047B1Sep 22, 2020
Smart thermostat control system
WELLS FARGO BANK NA14 citations85
US10177930B1Jan 8, 2019
Smart thermostat control system
WELLS FARGO BANK NA15 citations85
US10997645B1May 4, 2021
Optimized product preparation
WELLS FARGO BANK NA10 citations82
US10643231B1May 5, 2020
Incentives for physical activity
WELLS FARGO BANK NA2 citations71
E INK CORP
1 patentIP CAPITAL GROUP INC
1 patentCRONIN JOHN EDWARD
1 patentGARLAND STEPHEN DOUGLAS
1 patentShowing the top 50 of 55 patents by PatentIndex Score.