Inventor
HOWELL WAYNE JOHN
US32 patents
Patents
32 patentsUS6410431B2Jun 25, 2002
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
IBM127 citations99
US6294406B1Sep 25, 2001
Highly integrated chip-on-chip packaging
IBM120 citations99
US5977640ANov 2, 1999
Highly integrated chip-on-chip packaging
IBM585 citations99
US5648684AJul 15, 1997
Endcap chip with conductive, monolithic L-connect for multichip stack
IBM143 citations99
US5502333AMar 26, 1996
Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
IBM389 citations99
US6225699B1May 1, 2001
Chip-on-chip interconnections of varied characteristics
IBM98 citations98
US5946545AAug 31, 1999
Semiconductor stack structures and fabrication/sparing methods utilizing programmable spare circuit
IBM98 citations98
US5907178AMay 25, 1999
Multi-view imaging apparatus
IBM108 citations98
US5786628AJul 28, 1998
Method and workpiece for connecting a thin layer to a monolithic electronic modules surface and associated module packaging
IBM127 citations98
US5702984ADec 30, 1997
Integrated mulitchip memory module, structure and fabrication
IBM163 citations98
US5869896AFeb 9, 1999
Packaged electronic module and integral sensor array
IBM97 citations97
US5719438AFeb 17, 1998
Method and workpiece for connecting a thin layer to a monolithic electronic module's surface and associated module packaging
IBM97 citations97
US5691248ANov 25, 1997
Methods for precise definition of integrated circuit chip edges
IBM232 citations97
US6444490B2Sep 3, 2002
Micro-flex technology in semiconductor packages
IBM45 citations96
US6222276B1Apr 24, 2001
Through-chip conductors for low inductance chip-to-chip integration and off-chip connections
IBM82 citations96
US5925924AJul 20, 1999
Methods for precise definition of integrated circuit chip edges
IBM83 citations95
US5763943AJun 9, 1998
Electronic modules with integral sensor arrays
IBM54 citations95
US5811868ASep 22, 1998
Integrated high-performance decoupling capacitor
IBM94 citations94
US6858941B2Feb 22, 2005
Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
IBM25 citations92
US6642080B1Nov 4, 2003
Chip-on-chip interconnections of varied characterstics
IBM18 citations92
US6300687B1Oct 9, 2001
Micro-flex technology in semiconductor packages
IBM28 citations92
US5815374ASep 29, 1998
Method and apparatus for redirecting certain input/output connections of integrated circuit chip configurations
IBM34 citations92
US5798282AAug 25, 1998
Semiconductor stack structures and fabrication sparing methods utilizing programmable spare circuit
IBM22 citations92
US5781413AJul 14, 1998
Method and apparatus for directing the input/output connection of integrated circuit chip cube configurations
IBM22 citations92
US5923181AJul 13, 1999
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
IBM41 citations90
US5686843ANov 11, 1997
Methods and apparatus for burn-in stressing and simultaneous testing of semiconductor device chips in a multichip module
IBM30 citations90
US6921018B2Jul 26, 2005
Multi-chip stack and method of fabrication utilizing self-aligning electrical contact array
IBM8 citations74
US5804464ASep 8, 1998
Semiconductor chip kerf clear method for forming semiconductor chips and electronic module therefore
IBM8 citations73
US5670428ASep 23, 1997
Semiconductor chip kerf clear method and resultant semiconductor chip and electronic module formed from the same
IBM6 citations73
US5644162AJul 1, 1997
Semiconductor chip having chip metal layer and transfer metal layer composed of same metal, and corresponding electronic module
IBM9 citations73
US6605526B1Aug 12, 2003
Wirebond passivation pad connection using heated capillary
IBM4 citations60
US6455778B2Sep 24, 2002
Micro-flex technology in semiconductor packages
IBM0 citations52