Inventor
YEMENICIOGLU SUKRU
US11 patents
Patents
11 patentsUS12051692B2Jul 30, 2024
Integrated circuit structure with front side signal lines and backside power delivery
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US12532538B2Jan 20, 2026
Integrated circuit structures having conductive structures in fin isolation regions
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US12419085B2Sep 16, 2025
Integrated circuit structures having backside gate tie-down
INTEL CORP0 citations62
US12598803B2Apr 7, 2026
Integrated circuit structures having gate cut offset
INTEL CORP0 citations61
US12506059B2Dec 23, 2025
Vertically spaced intra-level interconnect line metallization for integrated circuit devices
INTEL CORP0 citations61
US11948874B2Apr 2, 2024
Vertically spaced intra-level interconnect line metallization for integrated circuit devices
INTEL CORP0 citations61
US12501661B2Dec 16, 2025
Integrated circuit structures having differentiated channel sizing
INTEL CORP0 citations60
US12469780B2Nov 11, 2025
Integrated circuit structure with recessed self-aligned deep boundary via
INTEL CORP0 citations58
US11764219B2Sep 19, 2023
Metal space centered standard cell architecture to enable higher cell density
INTEL CORP0 citations52
US12471330B2Nov 11, 2025
Integrated circuit structures having maximized channel sizing
INTEL CORP0 citations51
US12506075B2Dec 23, 2025
Epitaxial source/drain back-side device contact structures with wrap around metallization and protective conformal liner
INTEL CORP0 citations45