Inventor · disambiguated record
Shunya Yokozawa
Also filed as: YOKOZAWA SHUNYA
4 granted patents·2 pending applications·64 citations·filing 1980–2013
76Inventor score
Top patents by PatentIndex Score
6 records- 0182US4393188AThermosetting prepolymer from polyfunctional maleimide and bis maleimideHITACHI CHEMICAL CO LTD·Filed 1981·Granted Jul 12, 1983·38 cites·8 claims
- 0263US8801971B2Copper conductor film and manufacturing method thereof, conductive substrate and manufacturing method thereof, copper conductor wiring and manufacturing method thereof, and treatment solutionNAKAKO HIDEO·Filed 2008·Granted Aug 12, 2014·3 cites·7 claims
- 0354US4346206AImide prepolymer from reaction of epoxy compound with bis-imide/diamine reaction mixtureHITACHI CHEMICAL CO LTD·Filed 1980·Granted Aug 24, 1982·13 cites·3 claims
- 0449US2013295276A1Method for forming a copper wiring patternHITACHI CHEMICAL CO LTD·Filed 2013·Application pending·0 cites
- 0548US2010233011A1Method for forming a copper wiring pattern, and copper oxide particle dispersed slurry used thereinNAKAKO HIDEO·Filed 2008·Application pending·0 cites
- 0640US4400438AProcess for producing fire retardant and heat resistant copper-clad laminated board, and varnish thereforHITACHI CHEMICAL CO LTD·Filed 1981·Granted Aug 23, 1983·10 cites·3 claims
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